JPS6010761A - ダイオ−ド電極部品 - Google Patents

ダイオ−ド電極部品

Info

Publication number
JPS6010761A
JPS6010761A JP11940483A JP11940483A JPS6010761A JP S6010761 A JPS6010761 A JP S6010761A JP 11940483 A JP11940483 A JP 11940483A JP 11940483 A JP11940483 A JP 11940483A JP S6010761 A JPS6010761 A JP S6010761A
Authority
JP
Japan
Prior art keywords
section
diode
electrode
diameter part
diametral section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11940483A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6318334B2 (enrdf_load_stackoverflow
Inventor
Kazunao Kudo
和直 工藤
Hiromi Koyama
弘美 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP11940483A priority Critical patent/JPS6010761A/ja
Publication of JPS6010761A publication Critical patent/JPS6010761A/ja
Publication of JPS6318334B2 publication Critical patent/JPS6318334B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11940483A 1983-06-30 1983-06-30 ダイオ−ド電極部品 Granted JPS6010761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11940483A JPS6010761A (ja) 1983-06-30 1983-06-30 ダイオ−ド電極部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11940483A JPS6010761A (ja) 1983-06-30 1983-06-30 ダイオ−ド電極部品

Publications (2)

Publication Number Publication Date
JPS6010761A true JPS6010761A (ja) 1985-01-19
JPS6318334B2 JPS6318334B2 (enrdf_load_stackoverflow) 1988-04-18

Family

ID=14760640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11940483A Granted JPS6010761A (ja) 1983-06-30 1983-06-30 ダイオ−ド電極部品

Country Status (1)

Country Link
JP (1) JPS6010761A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182040U (enrdf_load_stackoverflow) * 1985-04-30 1986-11-13
US4789444A (en) * 1986-02-15 1988-12-06 Solex Research Corporation Of Japan Process for electrolytically producing metals of Ni, Co, Zn, Cu, Mn, and Cr from a solution thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883154U (ja) * 1981-11-30 1983-06-06 日本電気ホームエレクトロニクス株式会社 電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883154U (ja) * 1981-11-30 1983-06-06 日本電気ホームエレクトロニクス株式会社 電子部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182040U (enrdf_load_stackoverflow) * 1985-04-30 1986-11-13
US4789444A (en) * 1986-02-15 1988-12-06 Solex Research Corporation Of Japan Process for electrolytically producing metals of Ni, Co, Zn, Cu, Mn, and Cr from a solution thereof

Also Published As

Publication number Publication date
JPS6318334B2 (enrdf_load_stackoverflow) 1988-04-18

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