JPS63178423A - 電気接点の製造方法 - Google Patents
電気接点の製造方法Info
- Publication number
- JPS63178423A JPS63178423A JP1162187A JP1162187A JPS63178423A JP S63178423 A JPS63178423 A JP S63178423A JP 1162187 A JP1162187 A JP 1162187A JP 1162187 A JP1162187 A JP 1162187A JP S63178423 A JPS63178423 A JP S63178423A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- layer
- plating layer
- platinum
- reed switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000007747 plating Methods 0.000 claims description 49
- 239000010931 gold Substances 0.000 claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 15
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 11
- 239000011521 glass Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1162187A JPS63178423A (ja) | 1987-01-20 | 1987-01-20 | 電気接点の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1162187A JPS63178423A (ja) | 1987-01-20 | 1987-01-20 | 電気接点の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63178423A true JPS63178423A (ja) | 1988-07-22 |
JPH0528453B2 JPH0528453B2 (enrdf_load_stackoverflow) | 1993-04-26 |
Family
ID=11782992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1162187A Granted JPS63178423A (ja) | 1987-01-20 | 1987-01-20 | 電気接点の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63178423A (enrdf_load_stackoverflow) |
-
1987
- 1987-01-20 JP JP1162187A patent/JPS63178423A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0528453B2 (enrdf_load_stackoverflow) | 1993-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100381302B1 (ko) | 반도체 장치 및 그 제조방법 | |
JP3760075B2 (ja) | 半導体パッケージ用リードフレーム | |
JPS62133738A (ja) | 集積回路 | |
JPH10149943A (ja) | 磁器コンデンサ | |
JPH05308115A (ja) | 混成集積回路 | |
KR100874743B1 (ko) | 프린트 배선 기판, 그 제조 방법 및 반도체 장치 | |
JP2000133763A (ja) | 樹脂封止型半導体装置用の回路部材およびその製造方法 | |
JPH0763083B2 (ja) | 端子接続構造およびその接続方法 | |
JPS63178423A (ja) | 電気接点の製造方法 | |
JPH10233121A (ja) | リードワイヤ | |
JP2001111126A (ja) | 圧電素子 | |
JP2000031366A (ja) | 樹脂封止型半導体装置とそれに用いられる回路部材およびそれらの製造方法 | |
JP2858197B2 (ja) | 半導体装置用リードフレーム | |
JP2001035578A (ja) | 電子回路装置のテスト用ソケット及びその製造方法 | |
JP2858196B2 (ja) | 半導体装置用リードフレーム | |
JP3427038B2 (ja) | 圧電装置の製造方法 | |
JP2654872B2 (ja) | 半導体装置 | |
JP2000340596A (ja) | 半導体装置の製造方法 | |
JPH02226619A (ja) | 電気接点材料とその製造方法 | |
JPH0373962B2 (enrdf_load_stackoverflow) | ||
JPH07130790A (ja) | 半導体装置の電極構造 | |
KR100294911B1 (ko) | 반도체리드프레임 | |
JPH10261749A (ja) | 半導体装置 | |
JPH07153866A (ja) | セラミック回路基板 | |
JPS607162A (ja) | 半導体装置の製造方法 |