JPS63174453U - - Google Patents

Info

Publication number
JPS63174453U
JPS63174453U JP8095286U JP8095286U JPS63174453U JP S63174453 U JPS63174453 U JP S63174453U JP 8095286 U JP8095286 U JP 8095286U JP 8095286 U JP8095286 U JP 8095286U JP S63174453 U JPS63174453 U JP S63174453U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed semiconductor
sealed
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8095286U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8095286U priority Critical patent/JPS63174453U/ja
Publication of JPS63174453U publication Critical patent/JPS63174453U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP8095286U 1986-05-30 1986-05-30 Pending JPS63174453U (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8095286U JPS63174453U (enrdf_load_html_response) 1986-05-30 1986-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8095286U JPS63174453U (enrdf_load_html_response) 1986-05-30 1986-05-30

Publications (1)

Publication Number Publication Date
JPS63174453U true JPS63174453U (enrdf_load_html_response) 1988-11-11

Family

ID=30932236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8095286U Pending JPS63174453U (enrdf_load_html_response) 1986-05-30 1986-05-30

Country Status (1)

Country Link
JP (1) JPS63174453U (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020148879A1 (ja) * 2019-01-18 2020-07-23 三菱電機株式会社 半導体装置、半導体装置の製造方法及び電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582048A (ja) * 1981-06-29 1983-01-07 Toshiba Corp 樹脂封止半導体装置
JPS6251501A (ja) * 1985-08-27 1987-03-06 Shimizu Constr Co Ltd 定温倉庫搬送システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582048A (ja) * 1981-06-29 1983-01-07 Toshiba Corp 樹脂封止半導体装置
JPS6251501A (ja) * 1985-08-27 1987-03-06 Shimizu Constr Co Ltd 定温倉庫搬送システム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020148879A1 (ja) * 2019-01-18 2020-07-23 三菱電機株式会社 半導体装置、半導体装置の製造方法及び電力変換装置
JPWO2020148879A1 (ja) * 2019-01-18 2021-09-27 三菱電機株式会社 半導体装置、半導体装置の製造方法及び電力変換装置

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