JPS63165140A - 金属箔張り積層板の連続製造方法 - Google Patents

金属箔張り積層板の連続製造方法

Info

Publication number
JPS63165140A
JPS63165140A JP62315476A JP31547687A JPS63165140A JP S63165140 A JPS63165140 A JP S63165140A JP 62315476 A JP62315476 A JP 62315476A JP 31547687 A JP31547687 A JP 31547687A JP S63165140 A JPS63165140 A JP S63165140A
Authority
JP
Japan
Prior art keywords
metal foil
resin
cellulose fibers
clad laminate
unsaturated polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62315476A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6365507B2 (esLanguage
Inventor
八州男 伏木
大泉　正征
雅治 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP62315476A priority Critical patent/JPS63165140A/ja
Publication of JPS63165140A publication Critical patent/JPS63165140A/ja
Publication of JPS6365507B2 publication Critical patent/JPS6365507B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
JP62315476A 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法 Granted JPS63165140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62315476A JPS63165140A (ja) 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62315476A JPS63165140A (ja) 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法

Publications (2)

Publication Number Publication Date
JPS63165140A true JPS63165140A (ja) 1988-07-08
JPS6365507B2 JPS6365507B2 (esLanguage) 1988-12-15

Family

ID=18065814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62315476A Granted JPS63165140A (ja) 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法

Country Status (1)

Country Link
JP (1) JPS63165140A (esLanguage)

Also Published As

Publication number Publication date
JPS6365507B2 (esLanguage) 1988-12-15

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