JPS63160367A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS63160367A
JPS63160367A JP30658686A JP30658686A JPS63160367A JP S63160367 A JPS63160367 A JP S63160367A JP 30658686 A JP30658686 A JP 30658686A JP 30658686 A JP30658686 A JP 30658686A JP S63160367 A JPS63160367 A JP S63160367A
Authority
JP
Japan
Prior art keywords
resin
sealed
lead frame
semiconductor device
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30658686A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0521343B2 (cs
Inventor
Masaji Ogata
正次 尾形
Hidetoshi Abe
英俊 阿部
Masanori Segawa
正則 瀬川
Shigeo Suzuki
重雄 鈴木
Hiroyuki Hozoji
裕之 宝蔵寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP30658686A priority Critical patent/JPS63160367A/ja
Publication of JPS63160367A publication Critical patent/JPS63160367A/ja
Publication of JPH0521343B2 publication Critical patent/JPH0521343B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP30658686A 1986-12-24 1986-12-24 樹脂封止型半導体装置 Granted JPS63160367A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30658686A JPS63160367A (ja) 1986-12-24 1986-12-24 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30658686A JPS63160367A (ja) 1986-12-24 1986-12-24 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS63160367A true JPS63160367A (ja) 1988-07-04
JPH0521343B2 JPH0521343B2 (cs) 1993-03-24

Family

ID=17958848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30658686A Granted JPS63160367A (ja) 1986-12-24 1986-12-24 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS63160367A (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634762A1 (en) * 1990-09-13 1995-01-18 Matsushita Electric Industrial Co., Ltd. A method for producing a solid electrolytic capacitor
US5585195A (en) * 1992-07-11 1996-12-17 Shinko Electric Industries Company, Limited Metal insert and rough-surface treatment method thereof
EP1480270A3 (en) * 2003-05-22 2005-07-13 Shinko Electric Industries Co., Ltd. Packaging component and semiconductor package
EP2461357A2 (en) 2010-12-01 2012-06-06 Hitachi, Ltd. Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792854A (en) * 1980-11-29 1982-06-09 Toshiba Corp Plastic molded type semiconductor device
JPS5799763A (en) * 1980-12-12 1982-06-21 Hitachi Cable Ltd Manufacture of lead frame for integrated circuit
JPS6097651A (ja) * 1983-11-02 1985-05-31 Hitachi Ltd 半導体装置
JPS60119765A (ja) * 1983-12-02 1985-06-27 Hitachi Ltd 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792854A (en) * 1980-11-29 1982-06-09 Toshiba Corp Plastic molded type semiconductor device
JPS5799763A (en) * 1980-12-12 1982-06-21 Hitachi Cable Ltd Manufacture of lead frame for integrated circuit
JPS6097651A (ja) * 1983-11-02 1985-05-31 Hitachi Ltd 半導体装置
JPS60119765A (ja) * 1983-12-02 1985-06-27 Hitachi Ltd 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634762A1 (en) * 1990-09-13 1995-01-18 Matsushita Electric Industrial Co., Ltd. A method for producing a solid electrolytic capacitor
US5585195A (en) * 1992-07-11 1996-12-17 Shinko Electric Industries Company, Limited Metal insert and rough-surface treatment method thereof
EP1480270A3 (en) * 2003-05-22 2005-07-13 Shinko Electric Industries Co., Ltd. Packaging component and semiconductor package
US7190057B2 (en) 2003-05-22 2007-03-13 Shinko Electric Industries Co., Ltd. Packaging component and semiconductor package
EP2461357A2 (en) 2010-12-01 2012-06-06 Hitachi, Ltd. Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part
US9209044B2 (en) 2010-12-01 2015-12-08 Hitachi, Ltd. Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part

Also Published As

Publication number Publication date
JPH0521343B2 (cs) 1993-03-24

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