JPS63155631U - - Google Patents
Info
- Publication number
- JPS63155631U JPS63155631U JP4915987U JP4915987U JPS63155631U JP S63155631 U JPS63155631 U JP S63155631U JP 4915987 U JP4915987 U JP 4915987U JP 4915987 U JP4915987 U JP 4915987U JP S63155631 U JPS63155631 U JP S63155631U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- mounting
- recognition
- station
- monitoring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 238000012806 monitoring device Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Description
第１図は、本考案に係るマウント装置の要部の
みを示す側断面図、第２図は、従来のマウント装
置の要部のみを示す平面図である。
１３……基板、１５……ペレツト、１６，１７
……監視装置、１８……認識装置、Ａ，Ｂ，Ｃ，
Ｄ……ステーシヨン。
FIG. 1 is a side sectional view showing only the main parts of a mounting device according to the present invention, and FIG. 2 is a plan view showing only the main parts of a conventional mounting device. 13... Substrate, 15... Pellet, 16, 17
...Monitoring device, 18...Recognition device, A, B, C,
D...Station.
Claims (1)
の監視装置と認識装置で、ペレツト位置、又は、
ペレツト電極位置等を確認したペレツトを取付け
たり、又は、取付けたペレツトにボンデイング結
線したりするマウント装置において、前記監視装
置とは別個の監視装置を、ペレツト取付後又はボ
ンデイング結線後のステーシヨンに設け、その認
識装置を前記認識装置と共用するようにしたこと
を特徴とするマウント装置。 The substrate is fed in pitch at each station, and a pair of monitoring devices and recognition devices are used to check the pellet position or
In a mounting device for mounting a pellet whose pellet electrode position, etc. has been confirmed, or bonding the pellet to the mounted pellet, a monitoring device separate from the monitoring device is provided at the station after the pellet is mounted or bonded. A mounting device characterized in that the recognition device is shared with the recognition device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4915987U JPS63155631U (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4915987U JPS63155631U (en) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155631U true JPS63155631U (en) | 1988-10-12 |
Family
ID=30871351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4915987U Pending JPS63155631U (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155631U (en) |
-
1987
- 1987-03-31 JP JP4915987U patent/JPS63155631U/ja active Pending