JPS6251742U - - Google Patents
Info
- Publication number
- JPS6251742U JPS6251742U JP1985142783U JP14278385U JPS6251742U JP S6251742 U JPS6251742 U JP S6251742U JP 1985142783 U JP1985142783 U JP 1985142783U JP 14278385 U JP14278385 U JP 14278385U JP S6251742 U JPS6251742 U JP S6251742U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor chip
- chip
- bump members
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
- H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
- H01L2224/1412—Layout
- H01L2224/1414—Circular array, i.e. array with radial symmetry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案による半導体装置における半導
体チツプ上の半田バンプの配置を示す平面図、第
２図は従来の半導体装置における半導体チツプ上
の半田バンプの配置を示す平面図、第３図は従来
の半田バンプによるチツプ接続の状態を示す側面
図である。
１……半導体チツプ、２……基板、３１，３４
，４１〜４８……半田バンプ。
FIG. 1 is a plan view showing the arrangement of solder bumps on a semiconductor chip in a semiconductor device according to the present invention, FIG. 2 is a plan view showing the arrangement of solder bumps on a semiconductor chip in a conventional semiconductor device, and FIG. 3 is a plan view showing the arrangement of solder bumps on a semiconductor chip in a conventional semiconductor device. FIG. 3 is a side view showing the state of chip connection using solder bumps. 1... Semiconductor chip, 2... Substrate, 31, 34
, 41 to 48...Solder bumps.
Claims (1)
の複数のバンプ部材を設け、該バンプ部材の前記
基板との接触面積を半導体チツプ上で熱歪みが起
る中心から離れるほど大きくしたことを特徴とす
る半導体装置。 A semiconductor chip is provided with a plurality of bump members for connecting the chip to a substrate, and the contact area of the bump members with the substrate is increased as the distance from the center where thermal distortion occurs on the semiconductor chip increases. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985142783U JPS6251742U (en) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985142783U JPS6251742U (en) | 1985-09-20 | 1985-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6251742U true JPS6251742U (en) | 1987-03-31 |
Family
ID=31051838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985142783U Pending JPS6251742U (en) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6251742U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119740A (en) * | 1989-10-02 | 1991-05-22 | Hitachi Ltd | Structure of semiconductor device and its manufacturing apparatus |
| JPH03159144A (en) * | 1989-11-16 | 1991-07-09 | Hitachi Ltd | Semiconductor device |
| JPH05175274A (en) * | 1991-12-26 | 1993-07-13 | Matsushita Electric Ind Co Ltd | Chip component |
| JP2010529673A (en) * | 2007-06-07 | 2010-08-26 | シリコン・ワークス・カンパニー・リミテッド | Pad layout structure of semiconductor chip |
-
1985
- 1985-09-20 JP JP1985142783U patent/JPS6251742U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119740A (en) * | 1989-10-02 | 1991-05-22 | Hitachi Ltd | Structure of semiconductor device and its manufacturing apparatus |
| JPH03159144A (en) * | 1989-11-16 | 1991-07-09 | Hitachi Ltd | Semiconductor device |
| JPH05175274A (en) * | 1991-12-26 | 1993-07-13 | Matsushita Electric Ind Co Ltd | Chip component |
| JP2010529673A (en) * | 2007-06-07 | 2010-08-26 | シリコン・ワークス・カンパニー・リミテッド | Pad layout structure of semiconductor chip |