JPH031436U - - Google Patents
Info
- Publication number
- JPH031436U JPH031436U JP1989060245U JP6024589U JPH031436U JP H031436 U JPH031436 U JP H031436U JP 1989060245 U JP1989060245 U JP 1989060245U JP 6024589 U JP6024589 U JP 6024589U JP H031436 U JPH031436 U JP H031436U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrode
- fixed
- supported
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Description
第１図は本案の一実施例の略断面図、第２図ａ
，ｂ，ｃは第１図の構造を得るための説明図、第
３図は本案の他の実施例の略断面図、第４図は従
来の一例の略断面図である。
１……チツプ、２……バンプ、３……パツケー
ジ本体、４……キヤツプ、５……接着剤、６……
電極。
Figure 1 is a schematic sectional view of an embodiment of the present invention, Figure 2 a
, b, and c are explanatory diagrams for obtaining the structure of FIG. 1, FIG. 3 is a schematic sectional view of another embodiment of the present invention, and FIG. 4 is a schematic sectional view of a conventional example. 1... Chip, 2... Bump, 3... Package body, 4... Cap, 5... Adhesive, 6...
electrode.
Claims (1)
続し、チツプの他方の面を電極を支持する部材に
固定された部材によつて支持し固定したことを特
徴とする半導体素子実装装置。 A semiconductor element mounting apparatus characterized in that bumps formed on one side of a chip are connected to an electrode, and the other side of the chip is supported and fixed by a member fixed to a member supporting the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989060245U JPH031436U (en) | 1989-05-23 | 1989-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989060245U JPH031436U (en) | 1989-05-23 | 1989-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031436U true JPH031436U (en) | 1991-01-09 |
Family
ID=31587441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989060245U Pending JPH031436U (en) | 1989-05-23 | 1989-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031436U (en) |
-
1989
- 1989-05-23 JP JP1989060245U patent/JPH031436U/ja active Pending