JPS63127137U - - Google Patents

Info

Publication number
JPS63127137U
JPS63127137U JP1811087U JP1811087U JPS63127137U JP S63127137 U JPS63127137 U JP S63127137U JP 1811087 U JP1811087 U JP 1811087U JP 1811087 U JP1811087 U JP 1811087U JP S63127137 U JPS63127137 U JP S63127137U
Authority
JP
Japan
Prior art keywords
terminal
mold
semiconductor device
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1811087U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1811087U priority Critical patent/JPS63127137U/ja
Publication of JPS63127137U publication Critical patent/JPS63127137U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1811087U 1987-02-09 1987-02-09 Pending JPS63127137U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1811087U JPS63127137U (enrdf_load_stackoverflow) 1987-02-09 1987-02-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1811087U JPS63127137U (enrdf_load_stackoverflow) 1987-02-09 1987-02-09

Publications (1)

Publication Number Publication Date
JPS63127137U true JPS63127137U (enrdf_load_stackoverflow) 1988-08-19

Family

ID=30811490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1811087U Pending JPS63127137U (enrdf_load_stackoverflow) 1987-02-09 1987-02-09

Country Status (1)

Country Link
JP (1) JPS63127137U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0385650U (enrdf_load_stackoverflow) * 1989-12-21 1991-08-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0385650U (enrdf_load_stackoverflow) * 1989-12-21 1991-08-29

Similar Documents

Publication Publication Date Title
JPS63127137U (enrdf_load_stackoverflow)
JPS5827934U (ja) 半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS58440U (ja) プラスチツクパツケ−ジ
JPH0526760Y2 (enrdf_load_stackoverflow)
JPS619840U (ja) 樹脂封止型半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS606232U (ja) 半導体装置の樹脂外装体
JPS63124759U (enrdf_load_stackoverflow)
JPH01179351A (ja) 樹脂封止型半導体装置の製造方法
JPS59112951U (ja) 絶縁物封止半導体装置
JPS59195751U (ja) 樹脂封止型半導体装置
JPS6016553U (ja) 樹脂封止型半導体装置
JPS6073243U (ja) 樹脂封止形半導体装置
JPS6081652U (ja) 樹脂封止型半導体装置
JPS60129134U (ja) 樹脂封止構造
JPS5840843U (ja) 樹脂封止型半導体装置
JPS596844U (ja) 樹脂封止型半導体装置
JPS60144241U (ja) 樹脂封止型半導体装置
JPS63108641U (enrdf_load_stackoverflow)
JPS59111052U (ja) 混成集積回路装置
JPS60125730U (ja) 半導体装置の樹脂封止金型
JPS63108648U (enrdf_load_stackoverflow)
JPS6073249U (ja) 樹脂封止半導体装置
JPH0224555U (enrdf_load_stackoverflow)