JPS63111682A - 光半導体素子用サブマウント - Google Patents

光半導体素子用サブマウント

Info

Publication number
JPS63111682A
JPS63111682A JP61259023A JP25902386A JPS63111682A JP S63111682 A JPS63111682 A JP S63111682A JP 61259023 A JP61259023 A JP 61259023A JP 25902386 A JP25902386 A JP 25902386A JP S63111682 A JPS63111682 A JP S63111682A
Authority
JP
Japan
Prior art keywords
optical semiconductor
submount
semiconductor element
wire
bonding part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61259023A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459791B2 (enrdf_load_stackoverflow
Inventor
Yasuo Nakajima
康雄 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61259023A priority Critical patent/JPS63111682A/ja
Publication of JPS63111682A publication Critical patent/JPS63111682A/ja
Publication of JPH0459791B2 publication Critical patent/JPH0459791B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball

Landscapes

  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
JP61259023A 1986-10-29 1986-10-29 光半導体素子用サブマウント Granted JPS63111682A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61259023A JPS63111682A (ja) 1986-10-29 1986-10-29 光半導体素子用サブマウント

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61259023A JPS63111682A (ja) 1986-10-29 1986-10-29 光半導体素子用サブマウント

Publications (2)

Publication Number Publication Date
JPS63111682A true JPS63111682A (ja) 1988-05-16
JPH0459791B2 JPH0459791B2 (enrdf_load_stackoverflow) 1992-09-24

Family

ID=17328273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61259023A Granted JPS63111682A (ja) 1986-10-29 1986-10-29 光半導体素子用サブマウント

Country Status (1)

Country Link
JP (1) JPS63111682A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007129188A (ja) * 2005-10-07 2007-05-24 Hitachi Maxell Ltd 半導体装置、半導体モジュールおよび半導体モジュールの製造方法
JP2009510732A (ja) * 2005-09-30 2009-03-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 検出器装置および検出器素子
JP2010533975A (ja) * 2007-07-17 2010-10-28 クリー インコーポレイテッド 一体型定電流駆動回路を有するｌｅｄ
JP2012060133A (ja) * 2010-09-10 2012-03-22 Samsung Led Co Ltd 発光デバイス、照明装置およびバックライト
US8791645B2 (en) 2006-02-10 2014-07-29 Honeywell International Inc. Systems and methods for controlling light sources
US8803313B2 (en) 2003-01-02 2014-08-12 Cree, Inc. Group III nitride based flip-chip integrated circuit and method for fabricating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158459U (ja) * 1982-04-16 1983-10-22 三洋電機株式会社 発光ダイオ−ド

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158459U (ja) * 1982-04-16 1983-10-22 三洋電機株式会社 発光ダイオ−ド

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8803313B2 (en) 2003-01-02 2014-08-12 Cree, Inc. Group III nitride based flip-chip integrated circuit and method for fabricating
US9226383B2 (en) 2003-01-02 2015-12-29 Cree, Inc. Group III nitride based flip-chip integrated circuit and method for fabricating
JP2009510732A (ja) * 2005-09-30 2009-03-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 検出器装置および検出器素子
DE102005061206B4 (de) 2005-09-30 2019-10-17 Osram Opto Semiconductors Gmbh Verwendung einer Detektoranordnung als Umgebungslichtsensor
JP2007129188A (ja) * 2005-10-07 2007-05-24 Hitachi Maxell Ltd 半導体装置、半導体モジュールおよび半導体モジュールの製造方法
US8791645B2 (en) 2006-02-10 2014-07-29 Honeywell International Inc. Systems and methods for controlling light sources
US8937443B2 (en) 2006-02-10 2015-01-20 Honeywell International Inc. Systems and methods for controlling light sources
JP2010533975A (ja) * 2007-07-17 2010-10-28 クリー インコーポレイテッド 一体型定電流駆動回路を有するｌｅｄ
US8569970B2 (en) 2007-07-17 2013-10-29 Cree, Inc. LED with integrated constant current driver
US8810151B2 (en) 2007-07-17 2014-08-19 Cree, Inc. LED with integrated constant current driver
JP2012060133A (ja) * 2010-09-10 2012-03-22 Samsung Led Co Ltd 発光デバイス、照明装置およびバックライト

Also Published As

Publication number Publication date
JPH0459791B2 (enrdf_load_stackoverflow) 1992-09-24

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