JPS6310599B2 - - Google Patents
Info
- Publication number
- JPS6310599B2 JPS6310599B2 JP21806983A JP21806983A JPS6310599B2 JP S6310599 B2 JPS6310599 B2 JP S6310599B2 JP 21806983 A JP21806983 A JP 21806983A JP 21806983 A JP21806983 A JP 21806983A JP S6310599 B2 JPS6310599 B2 JP S6310599B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- printed wiring
- protective layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 29
- 239000011241 protective layer Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21806983A JPS60110196A (ja) | 1983-11-18 | 1983-11-18 | スルホ−ル印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21806983A JPS60110196A (ja) | 1983-11-18 | 1983-11-18 | スルホ−ル印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110196A JPS60110196A (ja) | 1985-06-15 |
| JPS6310599B2 true JPS6310599B2 (de) | 1988-03-08 |
Family
ID=16714158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21806983A Granted JPS60110196A (ja) | 1983-11-18 | 1983-11-18 | スルホ−ル印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110196A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0427182Y2 (de) * | 1986-11-07 | 1992-06-30 | ||
| JP3038144B2 (ja) * | 1995-12-25 | 2000-05-08 | 北陸電気工業株式会社 | 回路基板 |
-
1983
- 1983-11-18 JP JP21806983A patent/JPS60110196A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60110196A (ja) | 1985-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080302257A1 (en) | Legend printing stencil and method for manufacturing printed circuit boards using the same | |
| US5100695A (en) | Method of manufacturing a printed circuit board | |
| US5886878A (en) | Printed circuit board manufacturing method for through hole components with a metal case | |
| JPS6310599B2 (de) | ||
| US5219607A (en) | Method of manufacturing printed circuit board | |
| JPH06112633A (ja) | 回路用基板 | |
| JPH0430494A (ja) | 印刷配線板及びその製造法 | |
| JPH11238993A (ja) | 部品実装プリント基板及び部品実装プリント基板の実装方法 | |
| JPH0738239A (ja) | フレキシブルプリント配線板 | |
| JP3200754B2 (ja) | 半導体装置の製造方法 | |
| JPH11204897A (ja) | 印刷回路基板 | |
| JPH01217994A (ja) | 印刷配線板 | |
| KR900004079Y1 (ko) | 프린트 배선 기판 | |
| EP0375954B1 (de) | Verfahren zur Herstellung einer Leiterplatte | |
| JPH11150346A (ja) | 配線基板 | |
| KR910001141Y1 (ko) | 자기 헤드용 프린트 기판 | |
| JPS5917295A (ja) | 印刷配線基板 | |
| JPH05335734A (ja) | プリント配線板 | |
| JPH06216508A (ja) | プリント配線板 | |
| JPS6399594A (ja) | プリント配線基板の製造方法 | |
| JPH0529177U (ja) | 配線基板 | |
| JPS63181499A (ja) | プリント配線板 | |
| JPS63204790A (ja) | プリント配線板 | |
| JPS6393194A (ja) | マスキングテ−プを用いた部品実装方法 | |
| JPH02148793A (ja) | プリント配線板の製造方法 |