JPS629734Y2 - - Google Patents

Info

Publication number
JPS629734Y2
JPS629734Y2 JP1978160851U JP16085178U JPS629734Y2 JP S629734 Y2 JPS629734 Y2 JP S629734Y2 JP 1978160851 U JP1978160851 U JP 1978160851U JP 16085178 U JP16085178 U JP 16085178U JP S629734 Y2 JPS629734 Y2 JP S629734Y2
Authority
JP
Japan
Prior art keywords
plating layer
semiconductor substrate
heat sink
resin
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978160851U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5577846U (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978160851U priority Critical patent/JPS629734Y2/ja
Publication of JPS5577846U publication Critical patent/JPS5577846U/ja
Application granted granted Critical
Publication of JPS629734Y2 publication Critical patent/JPS629734Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
JP1978160851U 1978-11-22 1978-11-22 Expired JPS629734Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978160851U JPS629734Y2 (enFirst) 1978-11-22 1978-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978160851U JPS629734Y2 (enFirst) 1978-11-22 1978-11-22

Publications (2)

Publication Number Publication Date
JPS5577846U JPS5577846U (enFirst) 1980-05-29
JPS629734Y2 true JPS629734Y2 (enFirst) 1987-03-06

Family

ID=29155021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978160851U Expired JPS629734Y2 (enFirst) 1978-11-22 1978-11-22

Country Status (1)

Country Link
JP (1) JPS629734Y2 (enFirst)

Also Published As

Publication number Publication date
JPS5577846U (enFirst) 1980-05-29

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