JPS6296629A - 半導体装置のボンデイングワイヤ用Ｃｕ合金極細線 - Google Patents

半導体装置のボンデイングワイヤ用Ｃｕ合金極細線

Info

Publication number
JPS6296629A
JPS6296629A JP60235987A JP23598785A JPS6296629A JP S6296629 A JPS6296629 A JP S6296629A JP 60235987 A JP60235987 A JP 60235987A JP 23598785 A JP23598785 A JP 23598785A JP S6296629 A JPS6296629 A JP S6296629A
Authority
JP
Japan
Prior art keywords
wire
ultrafine
alloy
hardness
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60235987A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6312929B2 (esLanguage
Inventor
Naoyuki Hosoda
細田　直之
Naoki Uchiyama
直樹 内山
Toshiaki Ono
敏昭 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60235987A priority Critical patent/JPS6296629A/ja
Publication of JPS6296629A publication Critical patent/JPS6296629A/ja
Publication of JPS6312929B2 publication Critical patent/JPS6312929B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/01565—
    • H10W72/5522—
    • H10W72/5525—

Landscapes

  • Wire Bonding (AREA)
JP60235987A 1985-10-22 1985-10-22 半導体装置のボンデイングワイヤ用Ｃｕ合金極細線 Granted JPS6296629A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60235987A JPS6296629A (ja) 1985-10-22 1985-10-22 半導体装置のボンデイングワイヤ用Ｃｕ合金極細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60235987A JPS6296629A (ja) 1985-10-22 1985-10-22 半導体装置のボンデイングワイヤ用Ｃｕ合金極細線

Publications (2)

Publication Number Publication Date
JPS6296629A true JPS6296629A (ja) 1987-05-06
JPS6312929B2 JPS6312929B2 (esLanguage) 1988-03-23

Family

ID=16994133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60235987A Granted JPS6296629A (ja) 1985-10-22 1985-10-22 半導体装置のボンデイングワイヤ用Ｃｕ合金極細線

Country Status (1)

Country Link
JP (1) JPS6296629A (esLanguage)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7671919B2 (en) 2004-03-18 2010-03-02 Sony Corporation Camera

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7671919B2 (en) 2004-03-18 2010-03-02 Sony Corporation Camera

Also Published As

Publication number Publication date
JPS6312929B2 (esLanguage) 1988-03-23

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