JPH0412622B2 - - Google Patents

Info

Publication number
JPH0412622B2
JPH0412622B2 JP60100678A JP10067885A JPH0412622B2 JP H0412622 B2 JPH0412622 B2 JP H0412622B2 JP 60100678 A JP60100678 A JP 60100678A JP 10067885 A JP10067885 A JP 10067885A JP H0412622 B2 JPH0412622 B2 JP H0412622B2
Authority
JP
Japan
Prior art keywords
alloy
bonding
wire
ppm
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60100678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61258463A (ja
Inventor
Naoyuki Hosoda
Naoki Uchama
Toshiaki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP60100678A priority Critical patent/JPS61258463A/ja
Publication of JPS61258463A publication Critical patent/JPS61258463A/ja
Publication of JPH0412622B2 publication Critical patent/JPH0412622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/075—
    • H10W72/5525—
    • H10W72/952—

Landscapes

  • Wire Bonding (AREA)
JP60100678A 1985-05-13 1985-05-13 半導体装置用Ｃｕ合金製ボンディングワイヤ Granted JPS61258463A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60100678A JPS61258463A (ja) 1985-05-13 1985-05-13 半導体装置用Ｃｕ合金製ボンディングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60100678A JPS61258463A (ja) 1985-05-13 1985-05-13 半導体装置用Ｃｕ合金製ボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPS61258463A JPS61258463A (ja) 1986-11-15
JPH0412622B2 true JPH0412622B2 (esLanguage) 1992-03-05

Family

ID=14280409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60100678A Granted JPS61258463A (ja) 1985-05-13 1985-05-13 半導体装置用Ｃｕ合金製ボンディングワイヤ

Country Status (1)

Country Link
JP (1) JPS61258463A (esLanguage)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112012006138B4 (de) 2012-03-29 2016-12-01 Mitsubishi Electric Corporation Krümmungsvariabler Spiegel, krümmungsvariable Einheit und Herstellungsverfahren des krümmungsvariablen Spiegels

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS6148543A (ja) * 1984-08-10 1986-03-10 Sumitomo Electric Ind Ltd 半導体素子結線用銅合金線
JPS61234063A (ja) * 1985-04-10 1986-10-18 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線

Also Published As

Publication number Publication date
JPS61258463A (ja) 1986-11-15

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