JPS6282747U - - Google Patents
Info
- Publication number
- JPS6282747U JPS6282747U JP17523485U JP17523485U JPS6282747U JP S6282747 U JPS6282747 U JP S6282747U JP 17523485 U JP17523485 U JP 17523485U JP 17523485 U JP17523485 U JP 17523485U JP S6282747 U JPS6282747 U JP S6282747U
- Authority
- JP
- Japan
- Prior art keywords
- island
- semiconductor chip
- inner lead
- semiconductor
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図から第３図までは本考案の実施例を示し
、第１図はリードフレームの要部平面図、第２図
は第１図の―線視拡大断面図、第３図は他の
実施例における要部拡大断面図、第４図から第６
図までは従来技術を示し、第４図は平面図、第５
図は第４図の―線視拡大断面図、第６図は第
４図の―線視拡大断面図である。
１，１０……リードフレーム、２……半導体チ
ツプ、３……アイランド、４……インナーリード
部、５……枠体、６，６……タイバー、７，７…
…支持片、８……ワイヤー、９，９……接着テー
プ、１１……薄板状アイランド。
1 to 3 show embodiments of the present invention. FIG. 1 is a plan view of the main parts of the lead frame, FIG. Enlarged sectional views of main parts in the example, FIGS. 4 to 6
The figures up to the figures show the prior art; Fig. 4 is a plan view, and Fig. 5 is a plan view.
The drawings are an enlarged cross-sectional view taken along the line of FIG. 4, and FIG. 6 is an enlarged cross-sectional view taken along the line shown in FIG. DESCRIPTION OF SYMBOLS 1, 10... Lead frame, 2... Semiconductor chip, 3... Island, 4... Inner lead part, 5... Frame body, 6, 6... Tie bar, 7, 7...
...Support piece, 8...Wire, 9,9...Adhesive tape, 11...Thin plate island.
Claims (1)
ナーリード部を互いに適宜隔てて略放射状に配設
し、該各インナーリード部と前記半導体チツプと
をワイヤボンデイングして成る半導体用リードフ
レームにおいて、前記半導体チツプをマウントす
るアイランドを合成樹脂製の薄板状アイランドに
て成形し、該薄板状アイランドの片面を前記イン
ナーリード部の先端に接着したことを特徴とする
半導体リードフレーム。 A semiconductor lead frame comprising a plurality of narrow band-shaped inner lead portions arranged substantially radially around the outer periphery of a semiconductor chip, appropriately spaced from each other, and each of the inner lead portions and the semiconductor chip are wire-bonded. A semiconductor lead frame characterized in that an island on which a semiconductor chip is mounted is formed of a thin plate-like island made of synthetic resin, and one side of the thin plate-like island is adhered to the tip of the inner lead part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17523485U JPS6282747U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17523485U JPS6282747U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282747U true JPS6282747U (en) | 1987-05-27 |
Family
ID=31114367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17523485U Pending JPS6282747U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282747U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54114975A (en) * | 1978-02-27 | 1979-09-07 | Nec Corp | Semiconductor device |
| JPS58143541A (en) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | Semiconductor device |
-
1985
- 1985-11-14 JP JP17523485U patent/JPS6282747U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54114975A (en) * | 1978-02-27 | 1979-09-07 | Nec Corp | Semiconductor device |
| JPS58143541A (en) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | Semiconductor device |