JPS6281029A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS6281029A JPS6281029A JP22020785A JP22020785A JPS6281029A JP S6281029 A JPS6281029 A JP S6281029A JP 22020785 A JP22020785 A JP 22020785A JP 22020785 A JP22020785 A JP 22020785A JP S6281029 A JPS6281029 A JP S6281029A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- polyimide
- film
- etching
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229920001721 polyimide Polymers 0.000 claims abstract description 51
- 239000004642 Polyimide Substances 0.000 claims abstract description 49
- 239000010408 film Substances 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 28
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000001312 dry etching Methods 0.000 claims abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 7
- 239000003960 organic solvent Substances 0.000 abstract description 3
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22020785A JPS6281029A (ja) | 1985-10-04 | 1985-10-04 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22020785A JPS6281029A (ja) | 1985-10-04 | 1985-10-04 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6281029A true JPS6281029A (ja) | 1987-04-14 |
JPH0523493B2 JPH0523493B2 (enrdf_load_stackoverflow) | 1993-04-02 |
Family
ID=16747562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22020785A Granted JPS6281029A (ja) | 1985-10-04 | 1985-10-04 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6281029A (enrdf_load_stackoverflow) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125079A (ja) * | 1974-08-26 | 1976-03-01 | Fujitsu Ltd | Kotainetsuseijushimakuno shorihoho |
JPS59182531A (ja) * | 1983-04-01 | 1984-10-17 | Hitachi Micro Comput Eng Ltd | 半導体装置における絶縁膜加工法 |
-
1985
- 1985-10-04 JP JP22020785A patent/JPS6281029A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125079A (ja) * | 1974-08-26 | 1976-03-01 | Fujitsu Ltd | Kotainetsuseijushimakuno shorihoho |
JPS59182531A (ja) * | 1983-04-01 | 1984-10-17 | Hitachi Micro Comput Eng Ltd | 半導体装置における絶縁膜加工法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0523493B2 (enrdf_load_stackoverflow) | 1993-04-02 |
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