JPS6274088A - 超微細パタ−ンの形成処理方法 - Google Patents
超微細パタ−ンの形成処理方法Info
- Publication number
- JPS6274088A JPS6274088A JP21594985A JP21594985A JPS6274088A JP S6274088 A JPS6274088 A JP S6274088A JP 21594985 A JP21594985 A JP 21594985A JP 21594985 A JP21594985 A JP 21594985A JP S6274088 A JPS6274088 A JP S6274088A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- treated
- treating liquids
- supplied
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000011282 treatment Methods 0.000 title claims abstract description 13
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000000059 patterning Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 14
- 238000007796 conventional method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21594985A JPS6274088A (ja) | 1985-09-27 | 1985-09-27 | 超微細パタ−ンの形成処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21594985A JPS6274088A (ja) | 1985-09-27 | 1985-09-27 | 超微細パタ−ンの形成処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6274088A true JPS6274088A (ja) | 1987-04-04 |
| JPS6345460B2 JPS6345460B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-09-09 |
Family
ID=16680921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21594985A Granted JPS6274088A (ja) | 1985-09-27 | 1985-09-27 | 超微細パタ−ンの形成処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6274088A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015021182A (ja) * | 2013-07-23 | 2015-02-02 | 大日本印刷株式会社 | 金属薄板の液処理装置 |
-
1985
- 1985-09-27 JP JP21594985A patent/JPS6274088A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015021182A (ja) * | 2013-07-23 | 2015-02-02 | 大日本印刷株式会社 | 金属薄板の液処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345460B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-09-09 |
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