JPS6262868U - - Google Patents

Info

Publication number
JPS6262868U
JPS6262868U JP1985153308U JP15330885U JPS6262868U JP S6262868 U JPS6262868 U JP S6262868U JP 1985153308 U JP1985153308 U JP 1985153308U JP 15330885 U JP15330885 U JP 15330885U JP S6262868 U JPS6262868 U JP S6262868U
Authority
JP
Japan
Prior art keywords
workpiece
case
coating device
gas
spinner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985153308U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444216Y2 (US07923587-20110412-C00022.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985153308U priority Critical patent/JPH0444216Y2/ja
Priority to US06/914,328 priority patent/US4790262A/en
Publication of JPS6262868U publication Critical patent/JPS6262868U/ja
Application granted granted Critical
Publication of JPH0444216Y2 publication Critical patent/JPH0444216Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP1985153308U 1985-10-07 1985-10-07 Expired JPH0444216Y2 (US07923587-20110412-C00022.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985153308U JPH0444216Y2 (US07923587-20110412-C00022.png) 1985-10-07 1985-10-07
US06/914,328 US4790262A (en) 1985-10-07 1986-10-01 Thin-film coating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985153308U JPH0444216Y2 (US07923587-20110412-C00022.png) 1985-10-07 1985-10-07

Publications (2)

Publication Number Publication Date
JPS6262868U true JPS6262868U (US07923587-20110412-C00022.png) 1987-04-18
JPH0444216Y2 JPH0444216Y2 (US07923587-20110412-C00022.png) 1992-10-19

Family

ID=15559642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985153308U Expired JPH0444216Y2 (US07923587-20110412-C00022.png) 1985-10-07 1985-10-07

Country Status (2)

Country Link
US (1) US4790262A (US07923587-20110412-C00022.png)
JP (1) JPH0444216Y2 (US07923587-20110412-C00022.png)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261566A (en) * 1981-02-16 1993-11-16 Tokyo Ohka Kogyo Co., Ltd. Solution-dropping nozzle device
US5755886A (en) * 1986-12-19 1998-05-26 Applied Materials, Inc. Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing
JPH0829287B2 (ja) * 1987-09-18 1996-03-27 東京応化工業株式会社 塗布方法及び装置
JPH01121114U (US07923587-20110412-C00022.png) * 1988-02-04 1989-08-16
KR970006206B1 (ko) * 1988-02-10 1997-04-24 도오교오 에레구토론 가부시끼가이샤 자동 도포 시스템
KR970011644B1 (ko) * 1988-04-08 1997-07-12 고다까 토시오 도포 처리 장치
US5395446A (en) * 1988-11-21 1995-03-07 Kabushiki Kaisha Toshiba Semiconductor treatment apparatus
JPH02249225A (ja) * 1989-03-22 1990-10-05 Fujitsu Ltd レジスト塗布装置
US5042421A (en) * 1989-07-25 1991-08-27 Manhattan R&D, Inc. Rotatable vacuum chuck with magnetic means
EP0423761A3 (en) * 1989-10-17 1992-08-05 Applied Materials, Inc. Apparatus and method for particle removal by forced fluid convection
US5094885A (en) * 1990-10-12 1992-03-10 Genus, Inc. Differential pressure cvd chuck
JP3241058B2 (ja) * 1991-03-28 2001-12-25 大日本スクリーン製造株式会社 回転式塗布装置及び回転式塗布方法
JPH0734890B2 (ja) * 1991-10-29 1995-04-19 インターナショナル・ビジネス・マシーンズ・コーポレイション スピン・コーティング方法
US5395649A (en) * 1992-02-04 1995-03-07 Sony Corporation Spin coating apparatus for film formation over substrate
JP2654314B2 (ja) * 1992-06-04 1997-09-17 東京応化工業株式会社 裏面洗浄装置
US5378511A (en) * 1993-03-22 1995-01-03 International Business Machines Corporation Material-saving resist spinner and process
JP2907676B2 (ja) * 1993-03-30 1999-06-21 大日本スクリーン製造株式会社 回転式基板処理装置の処理液供給装置
US5427820A (en) * 1993-07-16 1995-06-27 Semiconductor Systems, Inc. Thermal control line for delivering liquid to a point of use in a photolithography system
US5371046A (en) * 1993-07-22 1994-12-06 Taiwan Semiconductor Manufacturing Company Method to solve sog non-uniformity in the VLSI process
US5608943A (en) * 1993-08-23 1997-03-11 Tokyo Electron Limited Apparatus for removing process liquid
TW285779B (US07923587-20110412-C00022.png) * 1994-08-08 1996-09-11 Tokyo Electron Co Ltd
JPH08316190A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板処理装置
WO1997009737A1 (en) 1995-09-01 1997-03-13 Advanced Semiconductor Materials America, Inc. Wafer support system
US6113702A (en) * 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
US5725663A (en) * 1996-01-31 1998-03-10 Solitec Wafer Processing, Inc. Apparatus for control of contamination in spin systems
US5952050A (en) * 1996-02-27 1999-09-14 Micron Technology, Inc. Chemical dispensing system for semiconductor wafer processing
JP3476305B2 (ja) * 1996-03-18 2003-12-10 大日本スクリーン製造株式会社 回転式基板処理装置
US5861061A (en) * 1996-06-21 1999-01-19 Micron Technology, Inc. Spin coating bowl
US5985031A (en) * 1996-06-21 1999-11-16 Micron Technology, Inc. Spin coating spindle and chuck assembly
US6413436B1 (en) 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US6350319B1 (en) * 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US5759273A (en) * 1996-07-16 1998-06-02 Micron Technology, Inc. Cross-section sample staining tool
US5960555A (en) * 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
US20050217707A1 (en) * 1998-03-13 2005-10-06 Aegerter Brian K Selective processing of microelectronic workpiece surfaces
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TW452828B (en) * 1998-03-13 2001-09-01 Semitool Inc Micro-environment reactor for processing a microelectronic workpiece
US6423642B1 (en) 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US6179924B1 (en) 1998-04-28 2001-01-30 Applied Materials, Inc. Heater for use in substrate processing apparatus to deposit tungsten
US6302960B1 (en) 1998-11-23 2001-10-16 Applied Materials, Inc. Photoresist coater
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US7217325B2 (en) * 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
TW527444B (en) 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
JP3616732B2 (ja) * 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US7102763B2 (en) 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6878206B2 (en) * 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US20050061676A1 (en) * 2001-03-12 2005-03-24 Wilson Gregory J. System for electrochemically processing a workpiece
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030168174A1 (en) 2002-03-08 2003-09-11 Foree Michael Todd Gas cushion susceptor system
KR100518788B1 (ko) * 2003-03-11 2005-10-05 삼성전자주식회사 감광액 도포 스핀 코팅 장치
JP4179276B2 (ja) * 2004-12-24 2008-11-12 セイコーエプソン株式会社 溶媒除去装置および溶媒除去方法
DE202005020274U1 (de) * 2005-12-23 2006-02-23 Bohnet, Saskia Beschichtungsanlage für Wafer
JP4985082B2 (ja) 2007-05-07 2012-07-25 東京エレクトロン株式会社 塗布膜形成装置、塗布膜形成装置の使用方法及び記憶媒体
US8092606B2 (en) 2007-12-18 2012-01-10 Asm Genitech Korea Ltd. Deposition apparatus
NL2017053B1 (en) * 2016-06-27 2018-01-05 Suss Microtec Lithography Gmbh Method for coating a substrate and also a coating system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112159U (US07923587-20110412-C00022.png) * 1972-12-29 1974-09-25
JPS5441675A (en) * 1977-09-09 1979-04-03 Hitachi Ltd Photo resist coating unit

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695928A (en) * 1970-12-07 1972-10-03 Western Electric Co Selective coating
US3950184A (en) * 1974-11-18 1976-04-13 Texas Instruments Incorporated Multichannel drainage system
JPS5252068A (en) * 1975-10-22 1977-04-26 Nissan Motor Co Ltd Oil pressure regulator of automobile transmission
JPS5819350B2 (ja) * 1976-04-08 1983-04-18 富士写真フイルム株式会社 スピンコ−テイング方法
US4037830A (en) * 1976-09-07 1977-07-26 International Business Machines Corporation Wafer handler
JPS5372464A (en) * 1976-12-08 1978-06-27 Matsushita Electric Ind Co Ltd Method and apparatus for rotary coating
JPS54113265A (en) * 1978-02-23 1979-09-04 Mitsubishi Electric Corp Resistor developing equipement
US4183545A (en) * 1978-07-28 1980-01-15 Advanced Simiconductor Materials/America Rotary vacuum-chuck using no rotary union
JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JPS57107032A (en) * 1980-12-25 1982-07-03 Toshiba Corp Coating device for semiconductor substrate
JPS57135067A (en) * 1981-02-16 1982-08-20 Tokyo Denshi Kagaku Kabushiki Thin film-applying machine
JPS58114426A (ja) * 1981-12-28 1983-07-07 Oki Electric Ind Co Ltd レジスト塗布装置
JPS5990928A (ja) * 1982-11-16 1984-05-25 Dainippon Screen Mfg Co Ltd 回転式表面処理装置
JPS59195827A (ja) * 1983-04-21 1984-11-07 Toshiba Corp レジスト塗布装置
US4510176A (en) * 1983-09-26 1985-04-09 At&T Bell Laboratories Removal of coating from periphery of a semiconductor wafer
US4518678A (en) * 1983-12-16 1985-05-21 Advanced Micro Devices, Inc. Selective removal of coating material on a coated substrate
NL8403459A (nl) * 1984-11-13 1986-06-02 Philips Nv Werkwijze en inrichting voor het aanbrengen van een laag van fotogevoelig materiaal op een halfgeleiderschijf.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112159U (US07923587-20110412-C00022.png) * 1972-12-29 1974-09-25
JPS5441675A (en) * 1977-09-09 1979-04-03 Hitachi Ltd Photo resist coating unit

Also Published As

Publication number Publication date
US4790262A (en) 1988-12-13
JPH0444216Y2 (US07923587-20110412-C00022.png) 1992-10-19

Similar Documents

Publication Publication Date Title
JPS6262868U (US07923587-20110412-C00022.png)
JPS61130368U (US07923587-20110412-C00022.png)
JPS6448170U (US07923587-20110412-C00022.png)
JPS6262870U (US07923587-20110412-C00022.png)
JPS61112843U (US07923587-20110412-C00022.png)
JPS62151976U (US07923587-20110412-C00022.png)
JPS6377665U (US07923587-20110412-C00022.png)
JPS6250768U (US07923587-20110412-C00022.png)
JPS62194468U (US07923587-20110412-C00022.png)
JPS61130375U (US07923587-20110412-C00022.png)
JPH0383795U (US07923587-20110412-C00022.png)
JPS5932832U (ja) 表面燃焼バ−ナ
JPH0356661U (US07923587-20110412-C00022.png)
JPH02129287U (US07923587-20110412-C00022.png)
JPS6369538U (US07923587-20110412-C00022.png)
JPH0224549U (US07923587-20110412-C00022.png)
JPS6424832U (US07923587-20110412-C00022.png)
JPS57128923A (en) Coating equipment of wafer fixing adhesive
JPS61139184U (US07923587-20110412-C00022.png)
JPS6311900U (US07923587-20110412-C00022.png)
JPS61132304U (US07923587-20110412-C00022.png)
JPS63144878U (US07923587-20110412-C00022.png)
JPS6295837U (US07923587-20110412-C00022.png)
JPH02102726U (US07923587-20110412-C00022.png)
JPS58183281U (ja) スプレプロセス装置