JPS6262551A - キャリア - Google Patents

キャリア

Info

Publication number
JPS6262551A
JPS6262551A JP61187008A JP18700886A JPS6262551A JP S6262551 A JPS6262551 A JP S6262551A JP 61187008 A JP61187008 A JP 61187008A JP 18700886 A JP18700886 A JP 18700886A JP S6262551 A JPS6262551 A JP S6262551A
Authority
JP
Japan
Prior art keywords
layer
copper
chromium
carrier
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61187008A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0255943B2 (enExample
Inventor
ジェローム・エス・サロ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of JPS6262551A publication Critical patent/JPS6262551A/ja
Publication of JPH0255943B2 publication Critical patent/JPH0255943B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
JP61187008A 1985-09-13 1986-08-11 キャリア Granted JPS6262551A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77591885A 1985-09-13 1985-09-13
US775918 1985-09-13

Publications (2)

Publication Number Publication Date
JPS6262551A true JPS6262551A (ja) 1987-03-19
JPH0255943B2 JPH0255943B2 (enExample) 1990-11-28

Family

ID=25105948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61187008A Granted JPS6262551A (ja) 1985-09-13 1986-08-11 キャリア

Country Status (8)

Country Link
EP (1) EP0215557B1 (enExample)
JP (1) JPS6262551A (enExample)
KR (1) KR900000865B1 (enExample)
CA (1) CA1302947C (enExample)
DE (1) DE3687250T2 (enExample)
HK (1) HK118693A (enExample)
MY (1) MY101626A (enExample)
SG (1) SG94193G (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6486527A (en) * 1987-09-29 1989-03-31 Hitachi Cable Ccb tape carrier
JPH01321687A (ja) * 1988-06-22 1989-12-27 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
JPH03159737A (ja) * 1989-11-17 1991-07-09 Ube Ind Ltd メタライズドポリイミドフィルムの製法
JPH0661601A (ja) * 1992-06-04 1994-03-04 Internatl Business Mach Corp <Ibm> メタライゼーション層及びその形成方法
JPH07299883A (ja) * 1994-04-29 1995-11-14 E I Du Pont De Nemours & Co ハイドロカルビル錫化合物含有金属被覆ポリイミドフィルムおよびその製造方法
JP2001270040A (ja) * 2000-03-21 2001-10-02 Ga-Tek Inc Dba Gould Electronics Inc 接着性が改善されたカッパ・オン・ポリマー構成要素

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
EP0386458A1 (de) * 1989-03-04 1990-09-12 Oerlikon-Contraves AG Verfahren zum Herstellen von Dünnschichtschaltungen mit Zinnstrukturen
US4962004A (en) * 1989-09-13 1990-10-09 Digital Equipment Corporation Method of inhibiting electrochemical reduction of polyimide during electroplating and articles formed thereby
DE69012271T2 (de) * 1989-09-22 1995-03-16 Minnesota Mining & Mfg Verfahren zur Elektroplattierung von elektroaktiven Polymeren und damit erhaltene Gegenstände.
US5038195A (en) * 1990-02-09 1991-08-06 Ibm Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
WO1992002040A1 (en) * 1990-07-25 1992-02-06 Dsm N.V. Package for incorporating an integrated circuit and a process for the production of the package
US5176811A (en) * 1991-02-01 1993-01-05 International Business Machines Corporation Gold plating bath additives for copper circuitization on polyimide printed circuit boards
US5461203A (en) * 1991-05-06 1995-10-24 International Business Machines Corporation Electronic package including lower water content polyimide film
CA2051604A1 (fr) * 1991-09-17 1993-03-18 Guy St-Amant Feuillards metalliques supportes sur plastique obtenu par metallisation-placage
CA2051611C (fr) * 1991-09-17 1996-01-23 Michel Gauthier Procede de preparation d'ensembles collecteurs-electrodes pour generateurs de films minces, ensembles collecteurs- electrodes et generateurs obtenus
US5427983A (en) * 1992-12-29 1995-06-27 International Business Machines Corporation Process for corrosion free multi-layer metal conductors
JPH08330728A (ja) * 1995-05-26 1996-12-13 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
US6424630B1 (en) 1998-10-30 2002-07-23 Advanced Micro Devices, Inc. Apparatus and method for calibrating a home networking station receiving network signals on a telephone line medium
WO2001047013A1 (en) * 1999-12-21 2001-06-28 Advanced Micro Devices, Inc. Organic packages with solders for reliable flip chip connections
BR0114432B1 (pt) 2000-10-09 2011-04-05 processo para produção de uma folha metalizada, e, folha metalizada.
DE102004054597B4 (de) * 2004-11-11 2019-07-25 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils
SG126776A1 (en) * 2005-04-08 2006-11-29 3M Innovative Properties Co Flexible circuit substrate
KR100796463B1 (ko) * 2005-11-16 2008-01-23 마이크로코즘 테크놀리지 씨오.,엘티디 가요성 인쇄 회로 및 그의 제조 방법
KR101159514B1 (ko) * 2007-05-24 2012-06-26 프린코 코포레이션 다층기판 금속배선 제조방법 및 그 구조
TWI411373B (zh) * 2007-05-25 2013-10-01 Princo Corp 多層基板金屬線路結構
TWI354523B (en) 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
CN114188543A (zh) * 2021-11-15 2022-03-15 深圳市宝明科技股份有限公司 一种复合导电铜箔及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729814A (en) 1967-04-04 1973-05-01 Gen Electric Method for making a composite
US3781596A (en) 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3981691A (en) 1974-07-01 1976-09-21 Minnesota Mining And Manufacturing Company Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers
US4444848A (en) * 1982-01-04 1984-04-24 Western Electric Co., Inc. Adherent metal coatings on rubber-modified epoxy resin surfaces

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6486527A (en) * 1987-09-29 1989-03-31 Hitachi Cable Ccb tape carrier
JPH01321687A (ja) * 1988-06-22 1989-12-27 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
JPH03159737A (ja) * 1989-11-17 1991-07-09 Ube Ind Ltd メタライズドポリイミドフィルムの製法
JPH0661601A (ja) * 1992-06-04 1994-03-04 Internatl Business Mach Corp <Ibm> メタライゼーション層及びその形成方法
JPH07299883A (ja) * 1994-04-29 1995-11-14 E I Du Pont De Nemours & Co ハイドロカルビル錫化合物含有金属被覆ポリイミドフィルムおよびその製造方法
JP2001270040A (ja) * 2000-03-21 2001-10-02 Ga-Tek Inc Dba Gould Electronics Inc 接着性が改善されたカッパ・オン・ポリマー構成要素

Also Published As

Publication number Publication date
KR900000865B1 (ko) 1990-02-17
DE3687250T2 (de) 1993-05-27
SG94193G (en) 1994-02-25
CA1302947C (en) 1992-06-09
HK118693A (en) 1993-11-12
JPH0255943B2 (enExample) 1990-11-28
EP0215557A2 (en) 1987-03-25
EP0215557B1 (en) 1992-12-09
KR870002941A (ko) 1987-04-14
MY101626A (en) 1991-12-31
EP0215557A3 (en) 1988-07-20
DE3687250D1 (de) 1993-01-21

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