JPS6260811B2 - - Google Patents
Info
- Publication number
- JPS6260811B2 JPS6260811B2 JP57223187A JP22318782A JPS6260811B2 JP S6260811 B2 JPS6260811 B2 JP S6260811B2 JP 57223187 A JP57223187 A JP 57223187A JP 22318782 A JP22318782 A JP 22318782A JP S6260811 B2 JPS6260811 B2 JP S6260811B2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- exhaust
- sample
- spin
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004528 spin coating Methods 0.000 claims description 11
- 235000012431 wafers Nutrition 0.000 description 19
- 206010040925 Skin striae Diseases 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22318782A JPS59121839A (ja) | 1982-12-20 | 1982-12-20 | スピン塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22318782A JPS59121839A (ja) | 1982-12-20 | 1982-12-20 | スピン塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59121839A JPS59121839A (ja) | 1984-07-14 |
JPS6260811B2 true JPS6260811B2 (zh) | 1987-12-18 |
Family
ID=16794161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22318782A Granted JPS59121839A (ja) | 1982-12-20 | 1982-12-20 | スピン塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59121839A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6227779U (zh) * | 1985-08-02 | 1987-02-19 | ||
JPS62237966A (ja) * | 1986-04-09 | 1987-10-17 | Pioneer Electronic Corp | 薄膜形成装置 |
US6516816B1 (en) * | 1999-04-08 | 2003-02-11 | Applied Materials, Inc. | Spin-rinse-dryer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58103132A (ja) * | 1981-12-16 | 1983-06-20 | Konishiroku Photo Ind Co Ltd | スピンナ−装置 |
-
1982
- 1982-12-20 JP JP22318782A patent/JPS59121839A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58103132A (ja) * | 1981-12-16 | 1983-06-20 | Konishiroku Photo Ind Co Ltd | スピンナ−装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS59121839A (ja) | 1984-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4318913B2 (ja) | 塗布処理装置 | |
US5826129A (en) | Substrate processing system | |
US6012470A (en) | Method of drying a wafer | |
KR19980080927A (ko) | 레지스트 도포방법 및 레지스트 도포장치 | |
CN1400631A (zh) | 涂敷型成膜方法、涂敷型成膜装置及半导体装置的制造方法 | |
KR19980066284A (ko) | 포토테지스트 도포장치 및 도포방법 | |
JPS6260811B2 (zh) | ||
JPH0747324A (ja) | 塗布方法及びその装置 | |
JP2001307984A (ja) | レジスト塗布方法およびレジスト塗布装置 | |
JPH0817817A (ja) | Sog膜の成膜方法及びsogコータ | |
JP2907877B2 (ja) | 塗布装置および塗布方法 | |
JP3485471B2 (ja) | 処理装置及び処理方法 | |
JPH06275506A (ja) | 回転塗布装置及びその方法 | |
JP2649156B2 (ja) | レジスト塗布装置と方法 | |
JP2000068182A (ja) | 塗布方法及び塗布装置 | |
JPS61206221A (ja) | スピン塗布装置 | |
JP2658710B2 (ja) | レジスト塗布装置 | |
JPH02219213A (ja) | レジスト塗布装置 | |
JPH0917722A (ja) | 塗布装置 | |
JPH03209741A (ja) | 真空吸着装置 | |
JPH03175615A (ja) | スピン塗布装置 | |
KR100206935B1 (ko) | 반도체 마스크 코팅장치 | |
JP2000218218A (ja) | 塗布膜形成方法および塗布処理システム | |
JPS5982975A (ja) | 半導体基板塗布装置 | |
JP2643656B2 (ja) | ウェハ現像処理装置 |