JPS62599B2 - - Google Patents

Info

Publication number

JPS62599B2

JPS62599B2 JP23347482A JP23347482A JPS62599B2 JP S62599 B2 JPS62599 B2 JP S62599B2 JP 23347482 A JP23347482 A JP 23347482A JP 23347482 A JP23347482 A JP 23347482A JP S62599 B2 JPS62599 B2 JP S62599B2

Authority

JP

Japan

Prior art keywords

layer

holes

metal layer

plating

printed wiring

Prior art date

1982-12-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• Global Dossier
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• 238000007747 plating Methods 0.000 claims description 39
• 239000002184 metal Substances 0.000 claims description 26
• 229910052751 metal Inorganic materials 0.000 claims description 26
• 229910000679 solder Inorganic materials 0.000 claims description 22
• 238000000034 method Methods 0.000 claims description 21
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
• 238000004519 manufacturing process Methods 0.000 claims description 16
• 229910052759 nickel Inorganic materials 0.000 claims description 9
• 238000005530 etching Methods 0.000 claims description 8
• 239000011248 coating agent Substances 0.000 claims description 5
• 238000000576 coating method Methods 0.000 claims description 5
• NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 4
• MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
• 238000009713 electroplating Methods 0.000 claims description 3
• 235000019270 ammonium chloride Nutrition 0.000 claims description 2
• QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
• 239000012964 benzotriazole Substances 0.000 claims description 2
• OOHAUGDGCWURIT-UHFFFAOYSA-N n,n-dipentylpentan-1-amine Chemical compound CCCCCN(CCCCC)CCCCC OOHAUGDGCWURIT-UHFFFAOYSA-N 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 35
• 229910052802 copper Inorganic materials 0.000 description 27
• 239000010949 copper Substances 0.000 description 27
• 239000011889 copper foil Substances 0.000 description 7
• 229920005989 resin Polymers 0.000 description 5
• 239000011347 resin Substances 0.000 description 5
• 230000004907 flux Effects 0.000 description 4
• JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
• 239000000126 substance Substances 0.000 description 4
• 238000011109 contamination Methods 0.000 description 3
• 230000003647 oxidation Effects 0.000 description 3
• 238000007254 oxidation reaction Methods 0.000 description 3
• 238000005498 polishing Methods 0.000 description 3
• 230000015572 biosynthetic process Effects 0.000 description 2
• 238000007730 finishing process Methods 0.000 description 2
• RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
• BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 229910000365 copper sulfate Inorganic materials 0.000 description 1
• ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000007772 electroless plating Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 1
• 238000007517 polishing process Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 230000007261 regionalization Effects 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1
• 239000002904 solvent Substances 0.000 description 1
• KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1

Cited By (1)