JPS6259460B2 - - Google Patents

Info

Publication number
JPS6259460B2
JPS6259460B2 JP55111709A JP11170980A JPS6259460B2 JP S6259460 B2 JPS6259460 B2 JP S6259460B2 JP 55111709 A JP55111709 A JP 55111709A JP 11170980 A JP11170980 A JP 11170980A JP S6259460 B2 JPS6259460 B2 JP S6259460B2
Authority
JP
Japan
Prior art keywords
pellet
bonding
attached
arm
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55111709A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5736836A (ja
Inventor
Yoshuki Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11170980A priority Critical patent/JPS5736836A/ja
Publication of JPS5736836A publication Critical patent/JPS5736836A/ja
Publication of JPS6259460B2 publication Critical patent/JPS6259460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP11170980A 1980-08-15 1980-08-15 Peretsutobonda Granted JPS5736836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11170980A JPS5736836A (ja) 1980-08-15 1980-08-15 Peretsutobonda

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11170980A JPS5736836A (ja) 1980-08-15 1980-08-15 Peretsutobonda

Publications (2)

Publication Number Publication Date
JPS5736836A JPS5736836A (ja) 1982-02-27
JPS6259460B2 true JPS6259460B2 (zh) 1987-12-11

Family

ID=14568163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11170980A Granted JPS5736836A (ja) 1980-08-15 1980-08-15 Peretsutobonda

Country Status (1)

Country Link
JP (1) JPS5736836A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227430A (ja) * 1984-04-26 1985-11-12 Nec Kyushu Ltd 半導体素子の固定装置
JPS60185335U (ja) * 1984-05-21 1985-12-09 新日本無線株式会社 半導体チツプの接着装置
JPS615531A (ja) * 1984-06-20 1986-01-11 Akita Denshi Kk 半導体組立装置
JP2851304B2 (ja) * 1989-05-29 1999-01-27 三菱重工業株式会社 インバータ方式加熱用電源装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056877A (zh) * 1973-09-14 1975-05-17
JPS53124067A (en) * 1976-10-29 1978-10-30 Hitachi Ltd Pellet bonding method
JPS56103431A (en) * 1980-01-22 1981-08-18 Shinkawa Ltd Scrubbing for diebonder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056877A (zh) * 1973-09-14 1975-05-17
JPS53124067A (en) * 1976-10-29 1978-10-30 Hitachi Ltd Pellet bonding method
JPS56103431A (en) * 1980-01-22 1981-08-18 Shinkawa Ltd Scrubbing for diebonder

Also Published As

Publication number Publication date
JPS5736836A (ja) 1982-02-27

Similar Documents

Publication Publication Date Title
US3941294A (en) Wire bonding apparatus with improved Z-axis motion control
JPH09298210A (ja) ダイボンディング装置
JPS60189231A (ja) ワイヤボンデイング装置
JPS6259460B2 (zh)
US4073424A (en) Second bond positioning wire bonder
CN110364911A (zh) 一种折弯机构
CN208098990U (zh) 一种折弯机构
JPS5565441A (en) Direct mounting
US20030183672A1 (en) Bonding apparatus
JPS59154053A (ja) 半導体成形品におけるリ−ド折曲方法及び装置
JPH1050736A (ja) ダイボンディング装置のボンディングヘッド
JPS56103429A (en) Die bonder
JP2701173B2 (ja) ボンダ用ツール保持機構
JPH1032294A (ja) 半導体パッケージのアウターリード折り曲げ加工方法およびアウターリード折り曲げ加工装置
JPH0310669Y2 (zh)
JPH08236993A (ja) 部品取付装置
JPH0427168Y2 (zh)
JPH056074Y2 (zh)
JPH029557Y2 (zh)
JPH0357621B2 (zh)
JPH0587952U (ja) 半導体ウェーハ特性測定装置
JPS5828739Y2 (ja) 部品供給装置
JPH0553686B2 (zh)
JP2676446B2 (ja) ワイヤボンディング方法
JPH0427167Y2 (zh)