JPS56103431A - Scrubbing for diebonder - Google Patents

Scrubbing for diebonder

Info

Publication number
JPS56103431A
JPS56103431A JP530280A JP530280A JPS56103431A JP S56103431 A JPS56103431 A JP S56103431A JP 530280 A JP530280 A JP 530280A JP 530280 A JP530280 A JP 530280A JP S56103431 A JPS56103431 A JP S56103431A
Authority
JP
Japan
Prior art keywords
scrubbing
bonding
axes
quality
drive motors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP530280A
Other languages
Japanese (ja)
Inventor
Yoshimitsu Terakado
Kazuhiro Hayakawa
Minoru Kawagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP530280A priority Critical patent/JPS56103431A/en
Publication of JPS56103431A publication Critical patent/JPS56103431A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the quality of the bonding by performing a scrubbing of an adsorption nozzle in a desired direction driven by drive motors set in X and Y axes so as to select a bonding part in the optimum direction and evenly spread the bonding layer. CONSTITUTION:An adsorption nozzle 1 is moved within a slight range while a die 16a is pressed fit on a lead frame. Here, positive or opposite pulse is applied selectively on drive motors set in X and Y axes, it can perform various scrubbing motions. The scrubbing of the nozzle in the optimum direction makes the spreading of a solder, an epoxy adhesive or the like evenly for bonding thereby improving the quality.
JP530280A 1980-01-22 1980-01-22 Scrubbing for diebonder Pending JPS56103431A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP530280A JPS56103431A (en) 1980-01-22 1980-01-22 Scrubbing for diebonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP530280A JPS56103431A (en) 1980-01-22 1980-01-22 Scrubbing for diebonder

Publications (1)

Publication Number Publication Date
JPS56103431A true JPS56103431A (en) 1981-08-18

Family

ID=11607453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP530280A Pending JPS56103431A (en) 1980-01-22 1980-01-22 Scrubbing for diebonder

Country Status (1)

Country Link
JP (1) JPS56103431A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5736836A (en) * 1980-08-15 1982-02-27 Hitachi Ltd Pellet bonder
US4913335A (en) * 1988-09-01 1990-04-03 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for die bonding

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5736836A (en) * 1980-08-15 1982-02-27 Hitachi Ltd Pellet bonder
JPS6259460B2 (en) * 1980-08-15 1987-12-11 Hitachi Ltd
US4913335A (en) * 1988-09-01 1990-04-03 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for die bonding

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