JPS6259460B2 - - Google Patents
Info
- Publication number
- JPS6259460B2 JPS6259460B2 JP55111709A JP11170980A JPS6259460B2 JP S6259460 B2 JPS6259460 B2 JP S6259460B2 JP 55111709 A JP55111709 A JP 55111709A JP 11170980 A JP11170980 A JP 11170980A JP S6259460 B2 JPS6259460 B2 JP S6259460B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- bonding
- attached
- arm
- cam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 description 7
- 238000005201 scrubbing Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】
本発明は半導体素子（ペレツト）を基板に固定
するペレツトボンダに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pellet bonder for fixing semiconductor devices (pellets) to a substrate.
半導体装置の組立に用いるペレツトボンダとし
て、本出願人は第１図に示す構造のペレツトボン
ダを開発している。このペレツトボンダのボンデ
イングアーム１はその途中をピン２を介して前後
動スライド棒３の先端下部から吊り降りた支持片
４の下端に揺動自在に取り付けられる。ボンデイ
ングアーム１の先端（図の左端）は基板５を載置
するテーブル６上に臨むとともに、その下端にペ
レツト７を真空吸着するコレツト８（たとえば、
吸着面が４角錐窪からなる角錐コレツト）が固定
される。また、ボンデイングアーム１の他端の上
面にはローラ９が接触する。このローラ９は前記
前後動スライド棒３の途中にピン１０を介して揺
動自在に取り付けられた逆Ｌ字形レバー１１の屈
曲下端に取り付けられている。また、前後動スラ
イド棒３のさらに後方には前記逆Ｌ字形レバー１
１と同一形状の駆動レバー１２がピン１３によつ
て前後動スライド棒３に揺動自在に取り付けられ
る。そして、これら逆Ｌ字形レバー１１と駆動レ
バー１２の上端にはそれぞれジヨイント１４，１
５がピン１６，１７を介して揺動自在に取り付け
られている。１対のジヨイント１４，１５は相互
に対面するとともに、両端にそれぞれ逆ねじとな
るねじ部を有するレベル調整ロツド１８のねじ部
にそれぞれ螺合される。したがつて、レベル調整
ロツド１８を回転させることによつて両ジヨイン
ト１４，１５のピン１６，１７間距離は変化す
る。 As a pellet bonder used for assembling semiconductor devices, the present applicant has developed a pellet bonder having the structure shown in FIG. A bonding arm 1 of this pellet bonder is swingably attached to the lower end of a support piece 4 suspended from the lower end of a longitudinally movable slide rod 3 through a pin 2 in the middle thereof. The tip of the bonding arm 1 (the left end in the figure) faces the table 6 on which the substrate 5 is placed, and a collet 8 (for example,
A pyramidal collect whose suction surface is a four-sided pyramidal depression is fixed. Furthermore, a roller 9 is in contact with the upper surface of the other end of the bonding arm 1 . This roller 9 is attached to the bent lower end of an inverted L-shaped lever 11 that is swingably attached to the middle of the longitudinally movable slide rod 3 via a pin 10. Furthermore, the inverted L-shaped lever 1 is located further rearward of the longitudinally movable slide rod 3.
A drive lever 12 having the same shape as 1 is swingably attached to the back and forth slide rod 3 by a pin 13. Joints 14 and 1 are provided at the upper ends of the inverted L-shaped lever 11 and the drive lever 12, respectively.
5 is swingably attached via pins 16 and 17. The pair of joints 14 and 15 face each other and are screwed into the threaded portions of a level adjustment rod 18, which has opposite threaded threads at both ends. Therefore, by rotating the level adjustment rod 18, the distance between the pins 16, 17 of both joints 14, 15 changes.
一方、駆動レバー１２の屈曲下端にはローラ１
９が回転可能に取り付けられている。このローラ
１９はピン２０を中心に揺動する上下動アーム２
１の揺動端上面に当接する。また、上下動アーム
２１の途中には下方に向かつて短かい支片２２が
設けられ、この支片２２にカムフオロア２３が取
り付けられている。このカムフオロア２３はカム
軸２４に取り付けられた上下動用カム２５に当接
する。したがつて、カム軸２４の回動により、ボ
ンデイングアーム１の先端のコレツト８は上下動
用カム２５のカム曲線に沿つて上下動する。ま
た、前記前後動スライド棒３の後端にはピン２６
を介して前後動アーム２７の揺動端が取り付けら
れている。この前後動アーム２７の他端はピン２
８で枢着される固定端となり、その中央には前記
カム軸２４に取り付けられた前後動用カム２９に
当接するカムフオロア３０が取り付けられてい
る。したがつて、このカム軸２４の回動によつて
前後動スライド棒３、すなわちコレツト８は前後
動用カム２９のカム曲線に沿つて前後動する。な
お、この前後動によつても駆動レバー１２のロー
ラ１９は上下動アーム２１の上面を転動し、常に
連繋するため、駆動レバー１２はコレツト８に上
下動用カム２５の動きを伝達することができる。 On the other hand, a roller 1 is attached to the lower bent end of the drive lever 12.
9 is rotatably attached. This roller 19 is a vertically movable arm 2 that swings around a pin 20.
It comes into contact with the upper surface of the swinging end of 1. Further, a short branch piece 22 facing downward is provided in the middle of the vertically movable arm 21, and a cam follower 23 is attached to this branch piece 22. This cam follower 23 contacts a vertically moving cam 25 attached to a camshaft 24. Therefore, as the cam shaft 24 rotates, the collet 8 at the tip of the bonding arm 1 moves up and down along the cam curve of the up-and-down cam 25. Further, a pin 26 is provided at the rear end of the longitudinally movable slide rod 3.
The swinging end of the back-and-forth swing arm 27 is attached via the. The other end of this longitudinally movable arm 27 is pin 2
The fixed end is pivoted at 8, and a cam follower 30 is attached to the center of the fixed end, which abuts a longitudinal cam 29 attached to the camshaft 24. Therefore, as the camshaft 24 rotates, the back-and-forth slide rod 3, that is, the collet 8, moves back and forth along the cam curve of the back-and-forth cam 29. Furthermore, even with this back and forth movement, the roller 19 of the drive lever 12 rolls on the upper surface of the vertical movement arm 21 and is always linked, so the drive lever 12 is unable to transmit the movement of the vertical movement cam 25 to the collet 8. can.
ところで、このような機構のペレツトボンダに
あつては、ペレツトボンデイング時のこすり付け
（スクラブ）は前後動用カム２９によつて決定さ
れる。一方、スクラブの振幅はペレツトサイズに
よつて変更することが望ましい。このため、スク
ラブ振幅を変える場合には前後動用カム２９を交
換しなければならず極めて面倒である。 In the pellet bonder having such a mechanism, the scrubbing during pellet bonding is determined by the back-and-forth movement cam 29. On the other hand, it is desirable to change the scrubbing amplitude depending on the pellet size. Therefore, when changing the scrub amplitude, the longitudinal movement cam 29 must be replaced, which is extremely troublesome.
また、このペレツトボンダはペレツト取付位置
が特定の位置に限られてしまう。このため、ハイ
ブリツドICのように、１つの基板にいくつもペ
レツトを取り付けるような場合には、作業者が基
板の位置修正をペレツトボンデイング毎に行なわ
なければできない難点がある。 Further, with this pellet bonder, the pellet mounting position is limited to a specific position. For this reason, when a number of pellets are attached to one substrate, such as in the case of hybrid ICs, there is a drawback that an operator must correct the position of the substrate each time pellet bonding is performed.
さらに、第２図に示すように、セラミツクパツ
ケージ型半導体装置のペレツトボンデイングにあ
つては、ベース３１の中央の窪み部分３２は狭
い。このため、取付位置が少しでもずれるとコレ
ツト８の下端周縁が窪み部分３２の縁に当接し、
ボンデイングが確実にできない難点もある。 Furthermore, as shown in FIG. 2, in pellet bonding of a ceramic package type semiconductor device, the recessed portion 32 at the center of the base 31 is narrow. For this reason, if the mounting position shifts even slightly, the lower edge of the collet 8 will come into contact with the edge of the recessed portion 32.
There is also the drawback that bonding cannot be performed reliably.
したがつて、本発明の目的はペレツトボンデイ
ング時にコレツト位置を簡単に修正することがで
きるとともに、ボンデイング時のスクラブ振幅を
調整できるペレツトボンダを提供することにあ
る。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a pellet bonder which allows the collet position to be easily corrected during pellet bonding and also allows the scrub amplitude during bonding to be adjusted.
このような目的を達成するために本発明は、モ
ータによつて平面Ｘ及びＹ方向に移動制御される
XYテーブルと、このXYテーブル上に取り付けら
れる支持体に途中を支軸によつて揺動自在に取り
付けられる略水平方向に延在するボンデイングア
ームと、ボンデイングアームの先端に取り付けら
れかつペレツトを下端に真空吸着するコレツト
と、ボンデイングアームの後端を上下動させる上
下動機構からなり、前記ペレツトをコレツトで保
持して所望部に取り付ける際にはパルスモータに
よつてXYテーブルを動作させてペレツトを所望
部にこすり付けるようにしてなるものであつて、
以下実施例により本発明を説明する。 In order to achieve such an object, the present invention provides a motor that controls movement in the plane X and Y directions.
An XY table, a bonding arm extending in a substantially horizontal direction that is swingably attached to a support attached to the XY table by a spindle, and a bonding arm that is attached to the tip of the bonding arm and that attaches pellets to the lower end. It consists of a vacuum suction collet and a vertical movement mechanism that moves the rear end of the bonding arm up and down.When holding the pellet with the collet and attaching it to a desired location, a pulse motor operates an XY table to move the pellet to the desired location. It is applied by rubbing it on the area,
The present invention will be explained below with reference to Examples.
第３図は本発明の一実施例によるペレツトボン
ダの概略図である。同図にはＸ用モータ３３によ
つてＸ方向に移動制御されるＸテーブル３４およ
びＹ用モータ３５によつてＹ方向に移動制御され
るＹテーブル３６からなるXYテーブル３７の上
には支持体３８が固定される。前記Ｘ用モータ３
３およびＹ用モータ３５はいずれもパルスモータ
からなり、XYテーブル３７のＸ方向およびまた
はＹ方向の移動長さはパルス数によつて決定され
る。なお、これらのモータ３３，３５は直流モー
タ等のモータでもよいことあきらかである。 FIG. 3 is a schematic diagram of a pellet bonder according to one embodiment of the present invention. In the figure, a support is placed on an XY table 37 consisting of an X table 34 whose movement is controlled in the X direction by an X motor 33 and a Y table 36 whose movement is controlled in the Y direction by a Y motor 35. 38 is fixed. Said motor 3 for X
3 and Y motor 35 are both pulse motors, and the moving length of the XY table 37 in the X direction and/or the Y direction is determined by the number of pulses. Note that it is clear that these motors 33 and 35 may be motors such as DC motors.
一方、前記支持体３８の一側には細長のボンデ
イングアーム１がその途中部分でピン（支軸）２
によつて揺動自在に取り付けられている。そし
て、ボンデイングアーム１の先端にはコレツト８
が取り付けられ、後端にはカムフオロア３９が取
り付けられている。また、カムフオロア３９は支
持体３８に回動自在に取り付けられた回転軸４０
に固定された上下動用カム２５の周面カム面に転
動接触している。 On the other hand, on one side of the support body 38, an elongated bonding arm 1 has a pin (support shaft) 2 at its midpoint.
It is attached so that it can swing freely. At the tip of bonding arm 1, there is a collect 8.
is attached, and a cam follower 39 is attached to the rear end. Further, the cam follower 39 is connected to a rotating shaft 40 rotatably attached to the support body 38.
It is in rolling contact with the circumferential cam surface of the vertical movement cam 25 fixed to.
このようなペレツトボンダにあつては、テーブ
ル６上に載置したハイブリツドIC用の基板５の
数個所にペレツトボンデイングを行なう場合、あ
らかじめXYテーブルの移動情報を記憶させてお
くことによつて、XY用モータ３３，３５をそれ
ぞれ所定のパルスによつて作動させ、テーブル６
上の基板の位置を調整することなく、基板上の数
個所のペレツトボンデイング位置にペレツト７を
正確に固定することができる。なお、ペレツト７
はペレツト収容治具４１上からコレツト８で取り
出してペレツトボンデイングを行なう。また、こ
の際、各ペレツトの大きさが異なつていたり、あ
るいはペレツトボンデイング条件が変わつてスク
ラブ回数やスクラブの振幅を変化させたい場合に
は、それぞれＸ・Ｙ用モータ３３，３５に加える
パルス数およびパルス印加時期を変化させること
によつて簡単に行なえる。さらに、スクラブ時に
Ｘ・Ｙ用モータを同時に作動させることによつ
て、コレツトをXY方向に同時にスクラブさせ、
ボンデイング性を向上させることができる。 With such a pellet bonder, when performing pellet bonding on several locations on the hybrid IC substrate 5 placed on the table 6, the XY table movement information can be stored in advance. The motors 33 and 35 for the table 6
Pellet 7 can be precisely fixed at several pellet bonding positions on the substrate without adjusting the position of the substrate above. In addition, pellet 7
The pellets are taken out from above the pellet storage jig 41 by the collect 8 and pellet bonding is performed. In addition, at this time, if the size of each pellet is different or if the pellet bonding conditions change and it is desired to change the number of scrubbing times or the scrubbing amplitude, pulses applied to the X and Y motors 33 and 35, respectively. This can be easily done by changing the number and pulse application timing. Furthermore, by simultaneously operating the X and Y motors during scrubbing, the collet can be scrubbed in the X and Y directions at the same time.
Bonding properties can be improved.
一方、治具に載つてテーブル上を移動してくる
セラミツクパツケージ用等の各ベースのテーブル
（治具）に対する位置ずれを、あらかじめ検出し
ておくとともに、ペレツトボンデイング時にペレ
ツトボンダにその情報をインプツトすることによ
つて、XYテーブル３７を制御し、各ベースに正
確確実にペレツトを固定することもできるように
なる。 On the other hand, it is necessary to detect in advance the positional deviation of each base for a ceramic package, etc., which is placed on a jig and moves on the table, with respect to the table (jig), and to input this information into the pellet bonder during pellet bonding. This also makes it possible to control the XY table 37 and securely and accurately fix pellets to each base.
なお、本発明は前記実施例に限定されない。 Note that the present invention is not limited to the above embodiments.
以上のように、本発明のペレツトボンダによれ
ば、コレツトの位置を簡単にかつ自由に調整でき
るとともに、ペレツトボンデイング時のスクラブ
の回数およびその振幅を電気的制御によつて簡単
に変更することができる。またスクラブをＸ方向
及びＹ方向に行ない閉ループ状の軌跡をもつて行
なうことができる。そのため、高精度でかつ高信
頼度のダイボンデイングを行なうことができる。 As described above, according to the pellet bonder of the present invention, the position of the collet can be easily and freely adjusted, and the number of scrubs and its amplitude during pellet bonding can be easily changed by electrical control. can. Further, the scrubbing can be performed in the X direction and the Y direction with a closed loop trajectory. Therefore, highly accurate and highly reliable die bonding can be performed.
第１図は開発されたペレツトボンダの機構を示
す概略図、第２図はセラミツクパツケージ型半導
体装置のペレツトボンデイング状態を示す断面
図、第３図は本発明の一実施例によるペレツトボ
ンダの概略図である。
１……ボンデイングアーム、５……基板、６…
…テーブル、７……ペレツト、８……コレツト、
３７……XYテーブル。
Fig. 1 is a schematic diagram showing the mechanism of the developed pellet bonder, Fig. 2 is a sectional view showing the pellet bonding state of a ceramic package type semiconductor device, and Fig. 3 is a schematic diagram of a pellet bonder according to an embodiment of the present invention. be. 1... Bonding arm, 5... Board, 6...
...Table, 7...Pellet, 8...Collection,
37...XY table.
Claims (1)
されるXYテーブルと、このXYテーブル上に取り
付けられる支持体に途中を支軸によつて揺動自在
に取り付けられる略水平方向に延在するボンデイ
ングアームと、ボンデイングアームの先端に取り
付けられかつペレツトを下端に真空吸着するコレ
ツトと、ボンデイングアームの後端を上下動させ
る上下動機構とからなり、前記ペレツトをコレツ
トで保持して所望部に取り付ける際には前記モー
タによつてXYテーブルを動作させてペレツトを
所望部にこすり付けるように構成したことを特徴
とするペレツトボンダ。1. An XY table whose movement is controlled by a motor in the plane X and Y directions, and a bonding member extending in a substantially horizontal direction that is swingably attached to a support mounted on the XY table with a support shaft in the middle. It consists of an arm, a collet that is attached to the tip of the bonding arm and vacuum-sucks the pellet to the lower end, and a vertical movement mechanism that moves the rear end of the bonding arm up and down. The pellet bonder is characterized in that the XY table is operated by the motor to rub the pellet onto a desired portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11170980A JPS5736836A (en) | 1980-08-15 | 1980-08-15 | Pellet bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11170980A JPS5736836A (en) | 1980-08-15 | 1980-08-15 | Pellet bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5736836A JPS5736836A (en) | 1982-02-27 |
| JPS6259460B2 true JPS6259460B2 (en) | 1987-12-11 |
Family
ID=14568163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11170980A Granted JPS5736836A (en) | 1980-08-15 | 1980-08-15 | Pellet bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5736836A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60227430A (en) * | 1984-04-26 | 1985-11-12 | Nec Kyushu Ltd | Device for fixing semiconductor element |
| JPS60185335U (en) * | 1984-05-21 | 1985-12-09 | 新日本無線株式会社 | Semiconductor chip bonding equipment |
| JPS615531A (en) * | 1984-06-20 | 1986-01-11 | Akita Denshi Kk | Semiconductor assembling device |
| JP2851304B2 (en) * | 1989-05-29 | 1999-01-27 | 三菱重工業株式会社 | Inverter type heating power supply |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5056877A (en) * | 1973-09-14 | 1975-05-17 | ||
| JPS53124067A (en) * | 1976-10-29 | 1978-10-30 | Hitachi Ltd | Pellet bonding method |
| JPS56103431A (en) * | 1980-01-22 | 1981-08-18 | Shinkawa Ltd | Scrubbing for diebonder |
-
1980
- 1980-08-15 JP JP11170980A patent/JPS5736836A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5056877A (en) * | 1973-09-14 | 1975-05-17 | ||
| JPS53124067A (en) * | 1976-10-29 | 1978-10-30 | Hitachi Ltd | Pellet bonding method |
| JPS56103431A (en) * | 1980-01-22 | 1981-08-18 | Shinkawa Ltd | Scrubbing for diebonder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5736836A (en) | 1982-02-27 |
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