JPS6258659B2 - - Google Patents

Info

Publication number
JPS6258659B2
JPS6258659B2 JP57009134A JP913482A JPS6258659B2 JP S6258659 B2 JPS6258659 B2 JP S6258659B2 JP 57009134 A JP57009134 A JP 57009134A JP 913482 A JP913482 A JP 913482A JP S6258659 B2 JPS6258659 B2 JP S6258659B2
Authority
JP
Japan
Prior art keywords
pellet
good
pellets
synthetic resin
resin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57009134A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58125837A (ja
Inventor
Hitoshi Fujimoto
Toshinobu Banjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57009134A priority Critical patent/JPS58125837A/ja
Publication of JPS58125837A publication Critical patent/JPS58125837A/ja
Publication of JPS6258659B2 publication Critical patent/JPS6258659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/0711—
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP57009134A 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置 Granted JPS58125837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57009134A JPS58125837A (ja) 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57009134A JPS58125837A (ja) 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置

Publications (2)

Publication Number Publication Date
JPS58125837A JPS58125837A (ja) 1983-07-27
JPS6258659B2 true JPS6258659B2 (enExample) 1987-12-07

Family

ID=11712150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57009134A Granted JPS58125837A (ja) 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置

Country Status (1)

Country Link
JP (1) JPS58125837A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108149A (ja) * 1984-10-31 1986-05-26 Kazumichi Kimura 半導体ペレツトの位置検出装置
JPS61147541A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
JPS61147542A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
JPH0267739A (ja) * 1988-09-01 1990-03-07 Mitsubishi Electric Corp ダイボンディング方法とその装置
JP4747445B2 (ja) * 2001-06-27 2011-08-17 株式会社島津製作所 天びん

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474376A (en) * 1977-11-26 1979-06-14 Toshiba Corp Position detection system for semiconductor chip
JPS54122980A (en) * 1978-03-16 1979-09-22 Nec Corp Surface inspection unit for semiconductor pellet
JPS575345A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Isolating and picking up method for pellet

Also Published As

Publication number Publication date
JPS58125837A (ja) 1983-07-27

Similar Documents

Publication Publication Date Title
US6610991B1 (en) Electronics assembly apparatus with stereo vision linescan sensor
KR100702071B1 (ko) 좌표화된 2차원과 3차원 화상 형성에 의해 물체의 형상을측정하는 방법 및 시스템
US5394246A (en) Bonding wire inspection apparatus and method
US5396334A (en) Bonding wire inspection apparatus
US5347362A (en) Bonding wire inspection method
US20230215770A1 (en) Semiconductor manufacturing apparatus, inspection apparatus, and manufacturing method for semiconductor device
JP3235009B2 (ja) ボンディングワイヤ検査方法
WO2001069206A1 (en) Imaging system
US5365341A (en) Bonding wire inspection apparatus
JPS6258659B2 (enExample)
US5293217A (en) Bonding wire inspection apparatus
JP3427248B2 (ja) 異物検出方法
JPH09293999A (ja) 部品実装機用画像撮像装置
JPH11248643A (ja) 透明フィルムの異物検査装置
JPH07208917A (ja) 自動焦点合わせ方法及び装置
JPS62276443A (ja) 自動穴ミス検査機
JP2751500B2 (ja) 半導体ペレットマウント装置
JPH04315905A (ja) 物体検査装置
JPH0338047A (ja) 半導体装置の製造方法
JPS6379342A (ja) アライメント装置
JPS63108736A (ja) ウエハプロ−バ装置
JPH03276092A (ja) 物品整列用治具への物品セッティング方法
JPH03136262A (ja) Ｉｃパッケージのリード端子浮き量検査装置
JP2003031601A (ja) 電子部品実装装置
JPS6152979B2 (enExample)