JPS6258536B2 - - Google Patents

Info

Publication number
JPS6258536B2
JPS6258536B2 JP55093868A JP9386880A JPS6258536B2 JP S6258536 B2 JPS6258536 B2 JP S6258536B2 JP 55093868 A JP55093868 A JP 55093868A JP 9386880 A JP9386880 A JP 9386880A JP S6258536 B2 JPS6258536 B2 JP S6258536B2
Authority
JP
Japan
Prior art keywords
substrate
temperature
solder
semiconductor element
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55093868A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5720441A (en
Inventor
Masaru Sakaguchi
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9386880A priority Critical patent/JPS5720441A/ja
Publication of JPS5720441A publication Critical patent/JPS5720441A/ja
Publication of JPS6258536B2 publication Critical patent/JPS6258536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/071—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/07188—
    • H10W72/07236—
    • H10W72/241—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP9386880A 1980-07-11 1980-07-11 Exchanging device for semiconductor element Granted JPS5720441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9386880A JPS5720441A (en) 1980-07-11 1980-07-11 Exchanging device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9386880A JPS5720441A (en) 1980-07-11 1980-07-11 Exchanging device for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5720441A JPS5720441A (en) 1982-02-02
JPS6258536B2 true JPS6258536B2 (enExample) 1987-12-07

Family

ID=14094422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9386880A Granted JPS5720441A (en) 1980-07-11 1980-07-11 Exchanging device for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5720441A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417439A (en) * 1987-07-10 1989-01-20 Fujitsu Ltd Device for removing test board
FR2746214B1 (fr) * 1996-03-15 1998-04-24 Procede et machine d'hybridation par refusion
US7288472B2 (en) * 2004-12-21 2007-10-30 Intel Corporation Method and system for performing die attach using a flame
JP5251456B2 (ja) * 2008-11-27 2013-07-31 株式会社デンソー 半田付け用真空加熱装置

Also Published As

Publication number Publication date
JPS5720441A (en) 1982-02-02

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