JPS62583B2 - - Google Patents

Info

Publication number
JPS62583B2
JPS62583B2 JP57084091A JP8409182A JPS62583B2 JP S62583 B2 JPS62583 B2 JP S62583B2 JP 57084091 A JP57084091 A JP 57084091A JP 8409182 A JP8409182 A JP 8409182A JP S62583 B2 JPS62583 B2 JP S62583B2
Authority
JP
Japan
Prior art keywords
plate
conductor
substrate
pattern
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57084091A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5818951A (ja
Inventor
Edoin Dautei Junia Uiriamu
Yuujin Guria Suchuaato
Jon Nesutooku Uiriamu
Teiruden Norisu Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5818951A publication Critical patent/JPS5818951A/ja
Publication of JPS62583B2 publication Critical patent/JPS62583B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W90/401—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP57084091A 1981-07-22 1982-05-20 半導体チツプ装着用基板 Granted JPS5818951A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28572581A 1981-07-22 1981-07-22
US285725 1981-07-22

Publications (2)

Publication Number Publication Date
JPS5818951A JPS5818951A (ja) 1983-02-03
JPS62583B2 true JPS62583B2 (OSRAM) 1987-01-08

Family

ID=23095459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084091A Granted JPS5818951A (ja) 1981-07-22 1982-05-20 半導体チツプ装着用基板

Country Status (4)

Country Link
EP (1) EP0070533B1 (OSRAM)
JP (1) JPS5818951A (OSRAM)
CA (1) CA1182582A (OSRAM)
DE (1) DE3277890D1 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674007A (en) * 1985-06-07 1987-06-16 Microscience Corporation Method and apparatus for facilitating production of electronic circuit boards
JPS63245952A (ja) * 1987-04-01 1988-10-13 Hitachi Ltd マルチチップモジュ−ル構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370203A (en) * 1965-07-19 1968-02-20 United Aircraft Corp Integrated circuit modules
FR1540051A (fr) * 1966-09-21 1968-09-20 Rca Corp Microcircuit et son procédé de fabrication
DE2964342D1 (en) * 1978-06-23 1983-01-27 Ibm Multi-layer dielectric substrate
JPS5612760A (en) * 1979-07-10 1981-02-07 Nec Corp Multi chip lsi package

Also Published As

Publication number Publication date
JPS5818951A (ja) 1983-02-03
EP0070533A3 (en) 1985-01-30
EP0070533A2 (de) 1983-01-26
DE3277890D1 (en) 1988-02-04
EP0070533B1 (de) 1987-12-23
CA1182582A (en) 1985-02-12

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