DE3277890D1 - Substrate for semiconductor chips - Google Patents
Substrate for semiconductor chipsInfo
- Publication number
- DE3277890D1 DE3277890D1 DE8282106401T DE3277890T DE3277890D1 DE 3277890 D1 DE3277890 D1 DE 3277890D1 DE 8282106401 T DE8282106401 T DE 8282106401T DE 3277890 T DE3277890 T DE 3277890T DE 3277890 D1 DE3277890 D1 DE 3277890D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- semiconductor chips
- chips
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/611—
-
- H10W90/401—
-
- H10W90/724—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28572581A | 1981-07-22 | 1981-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3277890D1 true DE3277890D1 (en) | 1988-02-04 |
Family
ID=23095459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8282106401T Expired DE3277890D1 (en) | 1981-07-22 | 1982-07-16 | Substrate for semiconductor chips |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0070533B1 (OSRAM) |
| JP (1) | JPS5818951A (OSRAM) |
| CA (1) | CA1182582A (OSRAM) |
| DE (1) | DE3277890D1 (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4674007A (en) * | 1985-06-07 | 1987-06-16 | Microscience Corporation | Method and apparatus for facilitating production of electronic circuit boards |
| JPS63245952A (ja) * | 1987-04-01 | 1988-10-13 | Hitachi Ltd | マルチチップモジュ−ル構造体 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3370203A (en) * | 1965-07-19 | 1968-02-20 | United Aircraft Corp | Integrated circuit modules |
| FR1540051A (fr) * | 1966-09-21 | 1968-09-20 | Rca Corp | Microcircuit et son procédé de fabrication |
| EP0006444B1 (de) * | 1978-06-23 | 1982-12-22 | International Business Machines Corporation | Vielschichtiges, dielektrisches Substrat |
| JPS5612760A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Multi chip lsi package |
-
1982
- 1982-05-20 JP JP57084091A patent/JPS5818951A/ja active Granted
- 1982-06-09 CA CA000404784A patent/CA1182582A/en not_active Expired
- 1982-07-16 EP EP82106401A patent/EP0070533B1/de not_active Expired
- 1982-07-16 DE DE8282106401T patent/DE3277890D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5818951A (ja) | 1983-02-03 |
| CA1182582A (en) | 1985-02-12 |
| JPS62583B2 (OSRAM) | 1987-01-08 |
| EP0070533B1 (de) | 1987-12-23 |
| EP0070533A2 (de) | 1983-01-26 |
| EP0070533A3 (en) | 1985-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |