JPS6257235A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS6257235A JPS6257235A JP19594485A JP19594485A JPS6257235A JP S6257235 A JPS6257235 A JP S6257235A JP 19594485 A JP19594485 A JP 19594485A JP 19594485 A JP19594485 A JP 19594485A JP S6257235 A JPS6257235 A JP S6257235A
- Authority
- JP
- Japan
- Prior art keywords
- film
- copper thin
- titanium
- thin film
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19594485A JPS6257235A (ja) | 1985-09-06 | 1985-09-06 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19594485A JPS6257235A (ja) | 1985-09-06 | 1985-09-06 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6257235A true JPS6257235A (ja) | 1987-03-12 |
| JPH0252856B2 JPH0252856B2 (enrdf_load_stackoverflow) | 1990-11-14 |
Family
ID=16349566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19594485A Granted JPS6257235A (ja) | 1985-09-06 | 1985-09-06 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6257235A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6457664A (en) * | 1987-08-27 | 1989-03-03 | Nec Corp | Contact connection structure |
-
1985
- 1985-09-06 JP JP19594485A patent/JPS6257235A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6457664A (en) * | 1987-08-27 | 1989-03-03 | Nec Corp | Contact connection structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0252856B2 (enrdf_load_stackoverflow) | 1990-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5196360A (en) | Methods for inhibiting outgrowth of silicide in self-aligned silicide process | |
| JPH0367334B2 (enrdf_load_stackoverflow) | ||
| KR20030044800A (ko) | 저저항 게이트 전극을 구비하는 반도체 장치 | |
| JPS61137367A (ja) | 半導体集積回路装置の製造方法 | |
| JP3626773B2 (ja) | 半導体デバイスの導電層、mosfet及びそれらの製造方法 | |
| JPS6298642A (ja) | 半導体集積回路装置の製造方法 | |
| JP3336604B2 (ja) | 半導体装置の製造方法 | |
| JPH03227516A (ja) | 半導体装置の製造方法 | |
| JPS6257235A (ja) | 半導体装置の製造方法 | |
| JPH08204188A (ja) | 半導体装置およびその製造方法 | |
| KR100200184B1 (ko) | 반도체 장치의 제조방법 | |
| KR0137435B1 (ko) | 반도체 장치의 티타늄 실리사이드층 형성방법 | |
| JP2621136B2 (ja) | 半導体装置の製造方法 | |
| JP2616034B2 (ja) | 半導体集積回路装置 | |
| JPH04303944A (ja) | 半導体装置の製造方法 | |
| JPS5836505B2 (ja) | 半導体記憶装置の製造方法 | |
| JP3095452B2 (ja) | 半導体素子の製造方法 | |
| JPH0227769A (ja) | 半導体装置 | |
| JPH0730108A (ja) | Mis型半導体装置及びその製造方法 | |
| JPH08264482A (ja) | 半導体装置の製造方法 | |
| JP2668380B2 (ja) | 半導体装置の製造方法 | |
| JP3123182B2 (ja) | 半導体装置及びその製造方法 | |
| JP2817209B2 (ja) | 半導体装置の製造方法 | |
| JPH0441510B2 (enrdf_load_stackoverflow) | ||
| JPS63227058A (ja) | 高融点金属シリサイドゲ−トmos電界効果トランジスタ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |