JPS6256665B2 - - Google Patents

Info

Publication number
JPS6256665B2
JPS6256665B2 JP58014515A JP1451583A JPS6256665B2 JP S6256665 B2 JPS6256665 B2 JP S6256665B2 JP 58014515 A JP58014515 A JP 58014515A JP 1451583 A JP1451583 A JP 1451583A JP S6256665 B2 JPS6256665 B2 JP S6256665B2
Authority
JP
Japan
Prior art keywords
brazing
lead frame
brazing material
lead
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58014515A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59141256A (ja
Inventor
Tetsuo Myoshi
Masao Sekihashi
Yoshuki Oosawa
Masakatsu Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58014515A priority Critical patent/JPS59141256A/ja
Publication of JPS59141256A publication Critical patent/JPS59141256A/ja
Publication of JPS6256665B2 publication Critical patent/JPS6256665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/093—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H05K3/3465—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58014515A 1983-02-02 1983-02-02 リ−ドフレ−ムのろう付け方法 Granted JPS59141256A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58014515A JPS59141256A (ja) 1983-02-02 1983-02-02 リ−ドフレ−ムのろう付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58014515A JPS59141256A (ja) 1983-02-02 1983-02-02 リ−ドフレ−ムのろう付け方法

Publications (2)

Publication Number Publication Date
JPS59141256A JPS59141256A (ja) 1984-08-13
JPS6256665B2 true JPS6256665B2 (cg-RX-API-DMAC10.html) 1987-11-26

Family

ID=11863220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58014515A Granted JPS59141256A (ja) 1983-02-02 1983-02-02 リ−ドフレ−ムのろう付け方法

Country Status (1)

Country Link
JP (1) JPS59141256A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789577B2 (ja) * 1986-07-14 1995-09-27 京セラ株式会社 半導体素子収納用パツケ−ジの製造法
JPH01121945U (cg-RX-API-DMAC10.html) * 1988-02-12 1989-08-18
JPH0241452U (cg-RX-API-DMAC10.html) * 1988-09-09 1990-03-22
US5358169A (en) * 1994-01-14 1994-10-25 Caddock Electronics, Inc. Method of soldering leads to electrical components

Also Published As

Publication number Publication date
JPS59141256A (ja) 1984-08-13

Similar Documents

Publication Publication Date Title
DE112013003902T5 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
JPS6256665B2 (cg-RX-API-DMAC10.html)
JP2908922B2 (ja) 半導体装置およびその製造方法
JPH01315167A (ja) 半導体装置
JPH03217024A (ja) 半導体装置
JPH06342966A (ja) 電子回路モジュール
JPH0745926A (ja) 部品実装用基板及び実装方法
JPS59177957A (ja) チツプ実装方法
JPH05218136A (ja) フリップチップ・ボンディング方法
JPH04199667A (ja) パッケージとその半田付け方法
JP3048236B2 (ja) 電子部品
JPH0356031Y2 (cg-RX-API-DMAC10.html)
JPS62163392A (ja) 電子部品の半田付け方法
JPH05206359A (ja) 半導体電子部品及び半導体電子部品の実装方法
JPH07263491A (ja) 半導体素子の実装方法
JPH02294097A (ja) 半導体装置の端子接合用マイクロカプセル
JPS63287047A (ja) 混成集積回路の外部リ−ド固着方法
JPS625690A (ja) 電子部品の半田付け方法
JPS63299855A (ja) ハンダ付け方法
JP2767677B2 (ja) リフロー時におけるメモリ用コネクタとプリント基板の仮止め方法
JPS59207690A (ja) 集積回路素子の実装方法
JPH0546281Y2 (cg-RX-API-DMAC10.html)
JPS60177611A (ja) 電子部品の製造方法
JPS62206843A (ja) 半導体素子接続方法
JPS60261122A (ja) 電子部品の製造方法