JPS6255718B2 - - Google Patents

Info

Publication number
JPS6255718B2
JPS6255718B2 JP55177205A JP17720580A JPS6255718B2 JP S6255718 B2 JPS6255718 B2 JP S6255718B2 JP 55177205 A JP55177205 A JP 55177205A JP 17720580 A JP17720580 A JP 17720580A JP S6255718 B2 JPS6255718 B2 JP S6255718B2
Authority
JP
Japan
Prior art keywords
stake
semiconductor component
guide path
inclined guide
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55177205A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57102033A (en
Inventor
Takeshi Hasegawa
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP55177205A priority Critical patent/JPS57102033A/ja
Publication of JPS57102033A publication Critical patent/JPS57102033A/ja
Publication of JPS6255718B2 publication Critical patent/JPS6255718B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP55177205A 1980-12-17 1980-12-17 Semiconductor parts supplying device Granted JPS57102033A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55177205A JPS57102033A (en) 1980-12-17 1980-12-17 Semiconductor parts supplying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55177205A JPS57102033A (en) 1980-12-17 1980-12-17 Semiconductor parts supplying device

Publications (2)

Publication Number Publication Date
JPS57102033A JPS57102033A (en) 1982-06-24
JPS6255718B2 true JPS6255718B2 (forum.php) 1987-11-20

Family

ID=16027006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55177205A Granted JPS57102033A (en) 1980-12-17 1980-12-17 Semiconductor parts supplying device

Country Status (1)

Country Link
JP (1) JPS57102033A (forum.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984598A (ja) * 1982-11-08 1984-05-16 アルプス電気株式会社 電子部品用のマガジンホルダ
JPS59197200A (ja) * 1983-04-25 1984-11-08 パイオニア株式会社 部品取付装置

Also Published As

Publication number Publication date
JPS57102033A (en) 1982-06-24

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