JPS57102033A - Semiconductor parts supplying device - Google Patents
Semiconductor parts supplying deviceInfo
- Publication number
- JPS57102033A JPS57102033A JP55177205A JP17720580A JPS57102033A JP S57102033 A JPS57102033 A JP S57102033A JP 55177205 A JP55177205 A JP 55177205A JP 17720580 A JP17720580 A JP 17720580A JP S57102033 A JPS57102033 A JP S57102033A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor parts
- stick
- semiconductor
- parts
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Abstract
PURPOSE:To automate semiconductor parts supplying work wholly by a method wherein a semiconductor parts being sent out slidingly from a stick inserted in a stick holder is separated and sent out by a releaving and sending mechanism. CONSTITUTION:The stick 5 accommodating the semiconductor parts forming a line is inserted in the holder 4. When the stick 5 is inserted completely, a swingable arm 10 is pushed down to release engagement of the semiconductor parts. Accordingly the semiconductor parts slides in a guide path 12 to be engaged with an engaging pin 27. When a pin 17 is rotated next, an engaging pin 26 comes up to engage with the second semicondutor parts from the lead, and the pin 27 comes down to release engagement of the leading semiconductor parts. Accordingly the leading semiconductor slides on a shoot 29 to be sent in the send-in part 30.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55177205A JPS57102033A (en) | 1980-12-17 | 1980-12-17 | Semiconductor parts supplying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55177205A JPS57102033A (en) | 1980-12-17 | 1980-12-17 | Semiconductor parts supplying device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57102033A true JPS57102033A (en) | 1982-06-24 |
JPS6255718B2 JPS6255718B2 (en) | 1987-11-20 |
Family
ID=16027006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55177205A Granted JPS57102033A (en) | 1980-12-17 | 1980-12-17 | Semiconductor parts supplying device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57102033A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984598A (en) * | 1982-11-08 | 1984-05-16 | アルプス電気株式会社 | Magazine holder for electronic part |
JPS59197200A (en) * | 1983-04-25 | 1984-11-08 | パイオニア株式会社 | Part mounting device |
-
1980
- 1980-12-17 JP JP55177205A patent/JPS57102033A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984598A (en) * | 1982-11-08 | 1984-05-16 | アルプス電気株式会社 | Magazine holder for electronic part |
JPS59197200A (en) * | 1983-04-25 | 1984-11-08 | パイオニア株式会社 | Part mounting device |
JPH035680B2 (en) * | 1983-04-25 | 1991-01-28 | Pioneer Electronic Corp |
Also Published As
Publication number | Publication date |
---|---|
JPS6255718B2 (en) | 1987-11-20 |
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