JPS625358B2 - - Google Patents
Info
- Publication number
- JPS625358B2 JPS625358B2 JP2220579A JP2220579A JPS625358B2 JP S625358 B2 JPS625358 B2 JP S625358B2 JP 2220579 A JP2220579 A JP 2220579A JP 2220579 A JP2220579 A JP 2220579A JP S625358 B2 JPS625358 B2 JP S625358B2
- Authority
- JP
- Japan
- Prior art keywords
- metal thin
- thin film
- film
- conductor pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 239000010409 thin film Substances 0.000 claims description 54
- 239000010408 film Substances 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 35
- 239000012212 insulator Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 19
- 238000010304 firing Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052762 osmium Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 12
- 238000007747 plating Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- HCYDVSFCQZCWOF-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].B(O)(O)O.[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].B(O)(O)O.[V+5] HCYDVSFCQZCWOF-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2220579A JPS55115392A (en) | 1979-02-27 | 1979-02-27 | Method of fabricating hybrid circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2220579A JPS55115392A (en) | 1979-02-27 | 1979-02-27 | Method of fabricating hybrid circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55115392A JPS55115392A (en) | 1980-09-05 |
| JPS625358B2 true JPS625358B2 (zh) | 1987-02-04 |
Family
ID=12076283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2220579A Granted JPS55115392A (en) | 1979-02-27 | 1979-02-27 | Method of fabricating hybrid circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55115392A (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6486224A (en) * | 1987-09-28 | 1989-03-30 | Nec Corp | Standby device for microcomputer |
| JPH07212988A (ja) * | 1994-01-14 | 1995-08-11 | Fujitsu Ten Ltd | マイクロコンピュータの電源装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4628149A (en) * | 1981-11-30 | 1986-12-09 | Nippon Electric Co., Ltd. | Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals |
| JPH0382188A (ja) * | 1989-08-25 | 1991-04-08 | Kyocera Corp | セラミック配線基板の製造方法 |
| JP4921426B2 (ja) * | 2008-06-30 | 2012-04-25 | イースタン技研株式会社 | 清水液防錆処理装置 |
-
1979
- 1979-02-27 JP JP2220579A patent/JPS55115392A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6486224A (en) * | 1987-09-28 | 1989-03-30 | Nec Corp | Standby device for microcomputer |
| JPH07212988A (ja) * | 1994-01-14 | 1995-08-11 | Fujitsu Ten Ltd | マイクロコンピュータの電源装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55115392A (en) | 1980-09-05 |
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