JPS5447664A - Production of head for heat sensitive recording - Google Patents
Production of head for heat sensitive recordingInfo
- Publication number
- JPS5447664A JPS5447664A JP11385877A JP11385877A JPS5447664A JP S5447664 A JPS5447664 A JP S5447664A JP 11385877 A JP11385877 A JP 11385877A JP 11385877 A JP11385877 A JP 11385877A JP S5447664 A JPS5447664 A JP S5447664A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductors
- copper
- gold
- copper oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Facsimile Heads (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
PURPOSE: To decrease the thickness of electrode conductors, rrduce the dispersion in the thickness and shape of resistors by their thickness and reduce the recess of the central part of the resistors by forming electrodes from the specific conductor thin-films formed on a substrate.
CONSTITUTION: Copper is evaporated or sputtered several 100 Å on a high purity alumina substrate 1 and gold several μ thereon. When the substrate 1 is heat- treated to 850 to 1100°C, copper becomes copper oxide and on the substrate 1 side of the copper, alumina and copper oxide bound to devolop a bonding strength. Since the bond layer of gold and copper oxide is formed on the gold side, gold provides a high bonding strength against the substrate 1 through copper oxide. On this conductor thin film are formed electrode conductors 3', 4' through photoetching. Next, resistors 2 are formed by a thick film in the form of being respectively connected between the conductors 3', 4' and further lead-out conductors 5, 6 are also formed by a thick film in the form of being respectively connected to the conductors 3', 4'
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11385877A JPS5447664A (en) | 1977-09-21 | 1977-09-21 | Production of head for heat sensitive recording |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11385877A JPS5447664A (en) | 1977-09-21 | 1977-09-21 | Production of head for heat sensitive recording |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5447664A true JPS5447664A (en) | 1979-04-14 |
JPS5547597B2 JPS5547597B2 (en) | 1980-12-01 |
Family
ID=14622832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11385877A Granted JPS5447664A (en) | 1977-09-21 | 1977-09-21 | Production of head for heat sensitive recording |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5447664A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150387A (en) * | 1979-05-14 | 1980-11-22 | Ricoh Co Ltd | Thermosensitive recording head |
EP0398364A2 (en) * | 1989-05-18 | 1990-11-22 | Kabushiki Kaisha Toshiba | Thick-film element having flattened resistor layer |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH051521U (en) * | 1991-06-28 | 1993-01-14 | 日本プラスト株式会社 | Ventilation system for vehicles |
-
1977
- 1977-09-21 JP JP11385877A patent/JPS5447664A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150387A (en) * | 1979-05-14 | 1980-11-22 | Ricoh Co Ltd | Thermosensitive recording head |
EP0398364A2 (en) * | 1989-05-18 | 1990-11-22 | Kabushiki Kaisha Toshiba | Thick-film element having flattened resistor layer |
Also Published As
Publication number | Publication date |
---|---|
JPS5547597B2 (en) | 1980-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1308477A (en) | Thin film circuits | |
EP0297319A3 (en) | Copper oxide ceramic conductive and superconductive thick films, and processes for film preparation | |
JPS5447664A (en) | Production of head for heat sensitive recording | |
JPS5548954A (en) | Manufacturing of film carrier | |
GB1287930A (en) | ||
JPS54126554A (en) | Thin film type thermal head | |
JPS5826680B2 (en) | Ceramic warm air conditioner | |
JPS5699680A (en) | Thermal head | |
JPS5387239A (en) | Heat sensitive heads with multiple layer wiring structure and manufacture thereof | |
GB1495377A (en) | Method of manufacturing a charge transfer device | |
JPH0239841B2 (en) | ||
JPS5795626A (en) | Manufacture of semiconductor device | |
JPH0737147B2 (en) | Thermal head and manufacturing method thereof | |
JPS61108569A (en) | Thermal print head | |
JPH0584680B2 (en) | ||
JPS63241846A (en) | Heat-proof black electrode | |
JPH01204763A (en) | Thermal head | |
JPS6297391A (en) | Thin film circuit | |
JPH0492879A (en) | Ceramic substrate for thick film hybrid ic | |
JPS6142858U (en) | Thick film circuit device | |
JPS56117671A (en) | Manufacture of thermal head | |
JPH01235664A (en) | Thin film type thermal head | |
JPS578175A (en) | Multilayer interconnection structure for crossover and manufacture thereof | |
JPS5469380A (en) | Production of display electrode substrate | |
JPS61168958A (en) | Gold-diffusion preventing layer |