JPS6252951B2 - - Google Patents

Info

Publication number
JPS6252951B2
JPS6252951B2 JP56094622A JP9462281A JPS6252951B2 JP S6252951 B2 JPS6252951 B2 JP S6252951B2 JP 56094622 A JP56094622 A JP 56094622A JP 9462281 A JP9462281 A JP 9462281A JP S6252951 B2 JPS6252951 B2 JP S6252951B2
Authority
JP
Japan
Prior art keywords
lead
lead frame
deformation
punching
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56094622A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57210651A (en
Inventor
Mitsugi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP9462281A priority Critical patent/JPS57210651A/ja
Publication of JPS57210651A publication Critical patent/JPS57210651A/ja
Publication of JPS6252951B2 publication Critical patent/JPS6252951B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9462281A 1981-06-19 1981-06-19 Lead frame and manufacture thereof Granted JPS57210651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9462281A JPS57210651A (en) 1981-06-19 1981-06-19 Lead frame and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9462281A JPS57210651A (en) 1981-06-19 1981-06-19 Lead frame and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS57210651A JPS57210651A (en) 1982-12-24
JPS6252951B2 true JPS6252951B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-11-07

Family

ID=14115347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9462281A Granted JPS57210651A (en) 1981-06-19 1981-06-19 Lead frame and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57210651A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144248U (ja) * 1984-03-02 1985-09-25 ロ−ム株式会社 リ−ドフレ−ム
JPS60189957A (ja) * 1984-03-12 1985-09-27 Toshiba Corp 半導体装置の製造方法
JPS62195164A (ja) * 1986-02-21 1987-08-27 Shinko Electric Ind Co Ltd リードフレームの製造方法
JPS6489551A (en) * 1987-09-30 1989-04-04 Nec Corp Manufacture of lead frame for semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933982B2 (ja) * 1976-07-22 1984-08-20 株式会社東芝 リ−ドフレ−ムの製造方法
JPS5933983B2 (ja) * 1977-05-13 1984-08-20 株式会社東芝 半導体装置用リ−ドフレ−ムの製造方法
JPS5472963A (en) * 1977-11-24 1979-06-11 Hitachi Ltd Lead frame for semiconductor element

Also Published As

Publication number Publication date
JPS57210651A (en) 1982-12-24

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