JPS6251503B2 - - Google Patents
Info
- Publication number
- JPS6251503B2 JPS6251503B2 JP57022691A JP2269182A JPS6251503B2 JP S6251503 B2 JPS6251503 B2 JP S6251503B2 JP 57022691 A JP57022691 A JP 57022691A JP 2269182 A JP2269182 A JP 2269182A JP S6251503 B2 JPS6251503 B2 JP S6251503B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- electronic component
- added
- amount
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/456—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57022691A JPS58141544A (ja) | 1982-02-17 | 1982-02-17 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57022691A JPS58141544A (ja) | 1982-02-17 | 1982-02-17 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58141544A JPS58141544A (ja) | 1983-08-22 |
| JPS6251503B2 true JPS6251503B2 (online.php) | 1987-10-30 |
Family
ID=12089893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57022691A Granted JPS58141544A (ja) | 1982-02-17 | 1982-02-17 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58141544A (online.php) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218865A (ja) * | 1984-04-13 | 1985-11-01 | Hitachi Ltd | 電子部品 |
| US5014112A (en) * | 1985-11-12 | 1991-05-07 | Texas Instruments Incorporated | Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame |
| US5082802A (en) * | 1985-11-12 | 1992-01-21 | Texas Instruments Incorporated | Method of making a memory device by packaging two integrated circuit dies in one package |
| JPS63312934A (ja) * | 1987-06-16 | 1988-12-21 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム材 |
| DE69110435T2 (de) * | 1990-12-20 | 1995-11-16 | Toshiba Kawasaki Kk | Kupferlegierungen und daraus hergestellte Leitergitter. |
| JPH05255777A (ja) * | 1992-10-16 | 1993-10-05 | Hitachi Cable Ltd | 半導体用リードフレーム材 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS5839901B2 (ja) * | 1978-03-10 | 1983-09-02 | 日本鉱業株式会社 | リ−ドフレ−ム用の銅合金 |
-
1982
- 1982-02-17 JP JP57022691A patent/JPS58141544A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58141544A (ja) | 1983-08-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11222659A (ja) | 金属複合帯板を製造する方法 | |
| JPH04329891A (ja) | 錫めっき銅合金材およびその製造方法 | |
| JPH0674479B2 (ja) | リードフレーム、コネクタもしくはスイッチ用導電圧延材料 | |
| JPS6251503B2 (online.php) | ||
| JP2521880B2 (ja) | 電子電気機器用銅合金とその製造法 | |
| JPH05306421A (ja) | 半導体装置用Cu合金リ−ド素材 | |
| JP2797846B2 (ja) | 樹脂封止型半導体装置のCu合金製リードフレーム材 | |
| JPH0717982B2 (ja) | リードフレーム、コネクタもしくはスイッチ用導電圧延材料 | |
| JPS64449B2 (online.php) | ||
| KR860000230B1 (ko) | 전자부품 | |
| JPS63109132A (ja) | 高力導電性銅合金及びその製造方法 | |
| JPH0682713B2 (ja) | 半導体リ−ド用テ−プ | |
| JPH0227792B2 (online.php) | ||
| JPH04165055A (ja) | 半導体装置用リードフレーム材 | |
| JPH0480103B2 (online.php) | ||
| JPS59140342A (ja) | リ−ドフレ−ム用銅合金 | |
| JPH0319702B2 (online.php) | ||
| JPS6218614B2 (online.php) | ||
| JP2537301B2 (ja) | 電子部品の製造方法 | |
| JPH0674463B2 (ja) | リ−ドフレ−ム用銅合金 | |
| DE2355162C2 (de) | Halbzeug für die Herstellung eines elektrischen Schutzrohrkontaktes | |
| JPH0331776B2 (online.php) | ||
| JPH01316432A (ja) | ハンダ耐候性にすぐれた導電材料用銅合金 | |
| JPH0325495B2 (online.php) | ||
| JPS6338546A (ja) | 高力伝導性銅合金 |