JPS6250227B2 - - Google Patents

Info

Publication number
JPS6250227B2
JPS6250227B2 JP17211180A JP17211180A JPS6250227B2 JP S6250227 B2 JPS6250227 B2 JP S6250227B2 JP 17211180 A JP17211180 A JP 17211180A JP 17211180 A JP17211180 A JP 17211180A JP S6250227 B2 JPS6250227 B2 JP S6250227B2
Authority
JP
Japan
Prior art keywords
cap
electrodes
electrode
welding
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17211180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56129346A (en
Inventor
Masami Kyono
Toshikazu Oshino
Toshiro Iba
Mitsuyoshi Oyama
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17211180A priority Critical patent/JPS56129346A/ja
Publication of JPS56129346A publication Critical patent/JPS56129346A/ja
Publication of JPS6250227B2 publication Critical patent/JPS6250227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
JP17211180A 1980-12-08 1980-12-08 Apparatus for welding seam Granted JPS56129346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14503975A Division JPS5268837A (en) 1975-12-08 1975-12-08 Atmospheric seam welding process

Publications (2)

Publication Number Publication Date
JPS56129346A JPS56129346A (en) 1981-10-09
JPS6250227B2 true JPS6250227B2 (enrdf_load_stackoverflow) 1987-10-23

Family

ID=15935751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17211180A Granted JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Country Status (1)

Country Link
JP (1) JPS56129346A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523495B2 (ja) * 2005-06-10 2010-08-11 オリジン電気株式会社 シーム接合方法及びシーム接合装置

Also Published As

Publication number Publication date
JPS56129346A (en) 1981-10-09

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