JPS6250227B2 - - Google Patents

Info

Publication number
JPS6250227B2
JPS6250227B2 JP17211180A JP17211180A JPS6250227B2 JP S6250227 B2 JPS6250227 B2 JP S6250227B2 JP 17211180 A JP17211180 A JP 17211180A JP 17211180 A JP17211180 A JP 17211180A JP S6250227 B2 JPS6250227 B2 JP S6250227B2
Authority
JP
Japan
Prior art keywords
cap
electrodes
electrode
welding
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17211180A
Other languages
Japanese (ja)
Other versions
JPS56129346A (en
Inventor
Masami Kyono
Toshikazu Oshino
Toshiro Iba
Mitsuyoshi Oyama
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17211180A priority Critical patent/JPS56129346A/en
Publication of JPS56129346A publication Critical patent/JPS56129346A/en
Publication of JPS6250227B2 publication Critical patent/JPS6250227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Description

【発明の詳細な説明】 本発明はシームウエルド装置、特に半導体装
置、半導体集積回路装置(IC)等の製造におい
て回路素子を被う外囲器の封止に使用されるシー
ムウエルド装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a seam weld device, and more particularly to a seam weld device used for sealing an envelope covering a circuit element in the manufacture of semiconductor devices, semiconductor integrated circuit devices (ICs), and the like.

周知のように、半導体素子は外界の影響を敏感
に受け易いため、外囲器(パツケージともいわれ
る)で半導体素子を被い、気密性を高め、半導体
装置の特性の劣化を防止している。ところで、こ
の封止技術の一つとして、外囲器本体に矩形のキ
ヤツプを重ね合わせ、このキヤツプの対応する平
行な2辺縁にそれぞれローラからなる電極を接触
通電させながら移動し外囲気本体とキヤツプとを
溶接するとともに、2辺の溶接が終了した後、他
の平行な2辺に電極を接触通電移動させながら溶
接を行なう。いわゆるパラレルローラシーム溶接
方法が知られている。
As is well known, semiconductor devices are sensitive to the effects of the outside world, so semiconductor devices are covered with an envelope (also called a package) to improve airtightness and prevent deterioration of the characteristics of the semiconductor device. By the way, as one of the sealing techniques, a rectangular cap is superimposed on the envelope body, and electrodes made of rollers are moved while contacting and energizing two corresponding parallel edges of the cap, and the cap is connected to the envelope body. At the same time, after welding on two sides is completed, welding is carried out while moving the electrodes to the other two parallel sides while contacting and energizing them. A so-called parallel roller seam welding method is known.

しかし、この溶接方法では、2度の溶接作業が
必要であり、また、最初の溶接作業後にキヤツプ
を90度回動調整する必要もあるため、作業性が低
い。また、作業性を向上させるため、溶接装置を
2台用意し、一方の溶接装置で平行なキヤツプ2
辺を溶接し、他方の溶接装置で他の平行なキヤツ
プ2辺を溶接する方法もあるが、設備費が嵩むと
ともに、期待できるほどの作業能率を向上させる
ことはできない。
However, this welding method requires two welding operations and also requires the cap to be rotated 90 degrees after the first welding operation, resulting in low workability. In addition, in order to improve work efficiency, two welding devices are prepared, and one welding device is used to connect two parallel caps.
There is also a method of welding one side and then using the other welding device to weld the other two parallel sides of the cap, but this increases equipment costs and does not improve work efficiency as much as expected.

また、このパラレルローラシーム溶接では、電
極がキヤツプ縁に接触すると同時に電流が流れ、
電極がキヤツプ縁から離れると同時に電流が切れ
ることが必要である。すなわち、電極がキヤツプ
縁に接触する前あるいは電極がキヤツプ縁から離
れた後に電流が流れると、電極とキヤツプ端縁と
の間に放電現象が発生して、キヤツプの隅部が変
色し、外観不良品ができてしまう。また、電極が
キヤツプ縁に接触してから電流が流れるまでの時
間が長かつたり、あるいは、電極がキヤツプ縁か
ら外れる前に電流が切れたりすると、溶接されな
い部分ができ、気密性の良くない製品ができてし
まう。
In addition, in this parallel roller seam welding, current flows at the same time as the electrode contacts the cap edge.
It is necessary that the current be turned off as soon as the electrode leaves the cap edge. That is, if a current flows before the electrode contacts the cap edge or after the electrode leaves the cap edge, a discharge phenomenon will occur between the electrode and the cap edge, causing discoloration of the corners of the cap and discoloration. A good product is produced. Also, if the time from when the electrode contacts the cap edge until the current flows, or if the current is cut off before the electrode comes off from the cap edge, there will be parts that are not welded, resulting in a product with poor airtightness. is created.

したがつて、本発明の目的は封止不良、外観不
良等が発生しないシームウエルド装置を提供する
ことにある。
Therefore, an object of the present invention is to provide a seam welding device that does not cause sealing defects or appearance defects.

また、本発明の他の目的は溶接時間の短かいシ
ームウエルド装置を提供することにある。
Another object of the present invention is to provide a seam welding device that requires short welding time.

以下実施例により本発明を詳細に説明する。 The present invention will be explained in detail below with reference to Examples.

第1図に本発明のシームウエルド装置の一実施
例を示す。同図に示すように、半導体素子等を取
り付けた外囲器本体1およびキヤツプ2を載置す
るテーブル3が示されている。このテーブル3は
モータ4によつて回転する。一方、前記テーブル
3上方には対抗する1対の電極5,6が配設され
ている。これら電極5,6の支持アーム7,8の
水平部9にはラツク10が設けられている。そし
て、このラツク10に噛み合うピニオン11はそ
れぞれ制御用モータ12,13の回転軸に取り付
けられている。このため、一対の電極はテーブル
の中心方向に向かつて接近あるいは後退するよう
になつている。また、前記テーブル3は一定の速
度で回転するが、電極5,6を移動調整する制御
用モータ12,13の回転数はテーブル3上に載
置されるキヤツプ2の矩形形状、すなわち、矩形
の短辺と長辺等によつて決定される。換言するな
らば、第2図に示すように、電極5,6はX軸上
を移動するだけであり、キヤツプ2の矢印方向の
回転によりX軸と交わるキヤツプ2の周辺の座標
は刻々と変化する。したがつて、常に電極5,6
がキヤツプ2の周縁に接触するように制御用モー
タ12,13を制御する。
FIG. 1 shows an embodiment of the seam welding device of the present invention. As shown in the figure, there is shown a table 3 on which an envelope body 1 and a cap 2 to which semiconductor elements and the like are attached are placed. This table 3 is rotated by a motor 4. On the other hand, a pair of opposing electrodes 5 and 6 are arranged above the table 3. A rack 10 is provided on the horizontal portion 9 of the support arms 7, 8 of these electrodes 5, 6. Pinions 11 that mesh with this rack 10 are attached to rotating shafts of control motors 12 and 13, respectively. Therefore, the pair of electrodes approaches or retreats toward the center of the table. Furthermore, although the table 3 rotates at a constant speed, the rotational speed of the control motors 12 and 13 for moving and adjusting the electrodes 5 and 6 is determined by the rectangular shape of the cap 2 placed on the table 3, that is, the rectangular shape. Determined by short side, long side, etc. In other words, as shown in Fig. 2, the electrodes 5 and 6 only move on the X-axis, and as the cap 2 rotates in the direction of the arrow, the coordinates around the cap 2 that intersect with the X-axis change every moment. do. Therefore, always electrodes 5, 6
The control motors 12 and 13 are controlled so that the cap 2 contacts the periphery of the cap 2.

つぎにこのようなシームウエルド装置による封
止(溶接)方法について説明すると、まず、半導
体素子等を組み込んだ外囲器本体1をテーブル3
上に固定するとともに、矩形のキヤツプ2を外囲
器本体1に重ね合わせ移動しないように固定す
る。なお、図示しない外囲器本体1の上面の矩形
枠部分およびキヤツプ2は導電材で形成されてい
る。その後、1対の電極5,6を、たとえば、第
2図に示すように、キヤツプ2の長辺部に接触さ
せる。そして、接触後これらの電極5,6間に電
圧を印加させることによつて、キヤツプ2と外囲
器本体1の接触部を抵抗発熱させて溶着させる。
また、電圧を印加させるとともに、テーブル3を
半回転(180度)させて、キヤツプ2と外囲器本
体1の全周を溶着させる。そして、封止が終了し
たら電流を切り、その後、電極5,6をキヤツプ
2から離す。なお、実際にはキヤツプに電極を接
触させた後、キヤツプを回転させ、一定の回転位
置まで回転させたら電流を流し、この位置から
180度+αだけの間通電する。その後、電流を切
つた後、キヤツプから電極を離す。
Next, we will explain the sealing (welding) method using such a seam welding device.
At the same time, the rectangular cap 2 is superimposed on the envelope body 1 and fixed so as not to move. Incidentally, a rectangular frame portion on the upper surface of the envelope main body 1 and the cap 2 (not shown) are formed of a conductive material. Thereafter, a pair of electrodes 5 and 6 are brought into contact with the long sides of the cap 2, for example, as shown in FIG. Then, by applying a voltage between these electrodes 5 and 6 after contact, the contact portions of the cap 2 and the envelope body 1 are heated by resistance and welded together.
Further, while applying a voltage, the table 3 is rotated half a turn (180 degrees) to weld the entire circumference of the cap 2 and the envelope body 1. When the sealing is completed, the current is turned off, and then the electrodes 5 and 6 are separated from the cap 2. In reality, after contacting the electrode with the cap, the cap is rotated until it reaches a certain rotational position, then a current is applied, and the cap is rotated from this position.
It is energized only for 180 degrees + α. Then, after turning off the current, remove the electrode from the cap.

このような実施例によれば、一度キヤツプに対
して電極を設定し、キヤツプを回転させるだけで
確実に封止ができる。したがつて、従来に較べて
封止時間が短縮でき、作業能率を向上させること
ができる。
According to such an embodiment, reliable sealing can be achieved simply by once setting the electrode on the cap and rotating the cap. Therefore, the sealing time can be shortened compared to the conventional method, and work efficiency can be improved.

また、この実施例では、キヤツプに電極が接触
しない状態では電圧は印加されない。このため、
キヤツプと電極との間に放電は生じない。したが
つて、従来のような放電による変色不良は生じな
い。
Further, in this embodiment, no voltage is applied when the electrode is not in contact with the cap. For this reason,
No discharge occurs between the cap and the electrode. Therefore, discoloration defects due to discharge as in the conventional case do not occur.

さらに、この実施例では通電はキヤツプ2を
180度+α回転する間行なうことから、従来のよ
うな未溶接部分が生じることもない。
Furthermore, in this embodiment, the current is applied to cap 2.
Since this is done while rotating by 180 degrees + α, there is no unwelded part like in the conventional method.

なお、本発明は前記実施例に限定されない。た
とえば、キヤツプの全周において均一な溶接を行
なうために、電極のキヤツプ線各部での溶接条
件、換言すれば、電極のキヤツプに対する接触移
動速度を一定にする手段を採用すれば、さらに、
確実な封止と作業の短時間化(高速化)を図るこ
とができる。すなわち、一定の速度でテーブルを
回転すると、電極とキヤツプ線各部の接触時間は
異なる。そして、キヤツプ各部が確実に溶接され
る条件では、場所によつては電極の接触時間が長
すぎる場合もある。しかし、各部の電極の接触時
間を一定にする場合では、確実に接着できる最高
速度を基準にすればよいので、さらに作業時間を
短縮することができる。また、テーブルの回転制
御は、キヤツプの長辺と短辺の長さや、電極の形
状等をマイクロプロセツサに入力して自動的に演
算処理して、その出力でモータ4を制御すればよ
い。
Note that the present invention is not limited to the above embodiments. For example, in order to perform uniform welding around the entire circumference of the cap, if welding conditions at each part of the cap wire of the electrode, in other words, a means of keeping the contact movement speed of the electrode with respect to the cap constant, are adopted,
It is possible to achieve reliable sealing and shorten the work time (speed up). That is, when the table is rotated at a constant speed, the contact time between the electrode and each part of the cap line differs. Under the conditions that each part of the cap can be reliably welded, the contact time of the electrodes may be too long depending on the location. However, in the case where the contact time of the electrodes at each part is constant, the maximum speed at which bonding can be ensured may be used as a reference, so that the working time can be further shortened. Further, the rotation of the table can be controlled by inputting the lengths of the long sides and short sides of the cap, the shape of the electrodes, etc. to a microprocessor, automatically processing the calculations, and controlling the motor 4 with the output thereof.

さらに、本発明は半導体装置の製造以外にも適
用できることは勿論である。
Furthermore, it goes without saying that the present invention can be applied to things other than manufacturing semiconductor devices.

以上のように、本発明のシームウエルド装置に
よれば、短時間で矩形のキヤツプを外囲器本体に
簡単に封止できるので封止作業の能率化を図るこ
とができる。
As described above, according to the seam welding device of the present invention, a rectangular cap can be easily sealed to the envelope main body in a short time, so that the efficiency of the sealing work can be improved.

また、本発明によれば、キヤツプのどの場所か
らも溶接を始めることができ、従来のように、キ
ヤツプの角部に確実に電極を位置させる必要もな
いので、操作が簡単であり、かつ放電による変色
不良および未溶接不良なども発生しないなど多く
の効果を奏する。
Furthermore, according to the present invention, welding can be started from any location on the cap, and there is no need to securely position the electrode at the corner of the cap unlike in the past, so the operation is simple and the discharge It has many effects such as no discoloration defects or unwelded defects caused by the welding process.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に従つたシームウエ
ルド装置の概略図、第2図は第1図の装置におけ
る電極とキヤツプとの関係を示す平面説明図であ
る。 1……外囲器本体、2……キヤツプ、3……テ
ーブル、4……モータ、5,6……電極、7,8
……支持アーム、9……水平部、10……ラツ
ク、11……ピニオン、12,13……制御用モ
ータ。
FIG. 1 is a schematic diagram of a seam welding device according to an embodiment of the present invention, and FIG. 2 is an explanatory plan view showing the relationship between electrodes and caps in the device of FIG. 1. 1... Envelope body, 2... Cap, 3... Table, 4... Motor, 5, 6... Electrode, 7, 8
... Support arm, 9 ... Horizontal part, 10 ... Rack, 11 ... Pinion, 12, 13 ... Control motor.

Claims (1)

【特許請求の範囲】[Claims] 1 一対の電極、上記両電極を被溶接物に接触さ
せる手段、上記両電極又は被溶接物を回転させる
手段、上記両電極間の距離を上記回転と共に変え
る手段を具備してなることを特徴とするシームウ
エルド装置。
1 A method comprising: a pair of electrodes; means for bringing both electrodes into contact with a workpiece; means for rotating the electrodes or the workpiece; and means for changing the distance between the electrodes along with the rotation. seam welding equipment.
JP17211180A 1980-12-08 1980-12-08 Apparatus for welding seam Granted JPS56129346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14503975A Division JPS5268837A (en) 1975-12-08 1975-12-08 Atmospheric seam welding process

Publications (2)

Publication Number Publication Date
JPS56129346A JPS56129346A (en) 1981-10-09
JPS6250227B2 true JPS6250227B2 (en) 1987-10-23

Family

ID=15935751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17211180A Granted JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Country Status (1)

Country Link
JP (1) JPS56129346A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523495B2 (en) * 2005-06-10 2010-08-11 オリジン電気株式会社 Seam joining method and seam joining apparatus

Also Published As

Publication number Publication date
JPS56129346A (en) 1981-10-09

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