JPH0455529B2 - - Google Patents
Info
- Publication number
- JPH0455529B2 JPH0455529B2 JP61268580A JP26858086A JPH0455529B2 JP H0455529 B2 JPH0455529 B2 JP H0455529B2 JP 61268580 A JP61268580 A JP 61268580A JP 26858086 A JP26858086 A JP 26858086A JP H0455529 B2 JPH0455529 B2 JP H0455529B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead
- wire
- tool
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010008 shearing Methods 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 abstract description 6
- 230000033001 locomotion Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000003909 pattern recognition Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000026058 directional locomotion Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、パワートランジスタにおける半導体
装置とリードとの間のワイヤボンデイングの如
き、太線ワイヤによる、ボンデイング装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding device using thick wire, such as wire bonding between a semiconductor device and a lead in a power transistor.
従来、例えば、0.1〜0.5mm程度の太線ワイヤボ
ンデイングにおいては、ワイヤボンデイングのた
めのツール先端と第１、第２ボンデイング位置の
位置合わせ及びワイヤ切断のためのツールエツジ
と第２ボンデイング位置のエツジの位置合わせは
作業者がワイヤボンデイングのたびに毎回手作業
で行つていた。即ち、ツール先端と第１ボンデイ
ング位置を作業者が合わせた後、第１ボンデイン
グが行われ、次に第２ボンデイング位置にツール
先端を作業者が合せて後、第２ボンデイングが行
われていた。そしてボンデイング終了後は第２ボ
ンデイング位置のエツジとツールのエツジの位置
合わせも作業者が行い、両者のせん断動作によつ
てワイヤ切断を行つていた。
Conventionally, for example, in thick wire bonding of about 0.1 to 0.5 mm, the positioning of the tool tip for wire bonding and the first and second bonding positions, and the position of the tool edge for wire cutting and the edge of the second bonding position are The alignment was done manually by workers each time they performed wire bonding. That is, the first bonding is performed after the operator aligns the tip of the tool with the first bonding position, and then the second bonding is performed after the operator aligns the tip of the tool with the second bonding position. After the bonding is completed, the operator also aligns the edge at the second bonding position with the edge of the tool, and the wire is cut by shearing action between the two.
従つて、効率的なボンデイング作業が行えず、
また、ボンデイング位置にバラツキが生じること
もあつた。他方、この位置合わせ作業は作業者に
とつて苛酷であつた。
Therefore, efficient bonding work cannot be performed,
In addition, variations in bonding positions sometimes occurred. On the other hand, this alignment work was difficult for the operator.
本発明は従来の問題点を解決しようとするもの
で、作業者による位置合わせが不要でボンデイン
グ作業の安定性、生産数の向上、コストダウンを
図ることのできるワイヤボンデイング装置を提供
することを目的とするものである。 The present invention is an attempt to solve the conventional problems, and an object of the present invention is to provide a wire bonding device that does not require alignment by an operator and can improve the stability of bonding work, increase production volume, and reduce costs. That is.
本発明は上述の従来の問題点を解決するための
手段として、基板上に固設した半導体装置とリー
ドとをワイヤでボンデイングし、第２ボンデイン
グを施された半導体装置又はリードのエツジとボ
ンデイングツールのエツジとでワイヤをせん断に
より切断する、ワイヤボンデイング装置におい
て、前記基板を保持する保持フレームと、該保持
フレームと前記ボンデイングツールとを互いに直
角なＸ，Ｙ，Ｚ方向に相対的に移動させるＸ，
Ｙ，Ｚ移動装置と、前記保持フレームと前記ボン
デイングツールとをＺ方向の軸のまわりに相対的
に回動せしめる回転装置と、前記半導体装置と前
記リードのそれぞれのボンデイング位置を検出す
る検出装置とを備え、前記検出値に応じて前記
Ｘ，Ｙ，Ｚ移動装置と回転装置とを駆動する駆動
装置と、前記検出値により第２ボンデイングを施
された半導体装置又はリードのワイヤ切断エツジ
位置を算出する算出装置と、該算出値に応じて前
記Ｘ，Ｙ，Ｚ移動装置を駆動し、前記第２ボンデ
イングを施された半導体装置又はリードとボンデ
イングツールのエツジにせん断動作をせしめてワ
イヤを切断する駆動装置とを、備えたことを特徴
とするワイヤボンデイング装置を提供しようとす
るものである。
As a means for solving the above-mentioned conventional problems, the present invention involves bonding a semiconductor device fixed on a substrate with a lead using a wire, and bonding the edge of the semiconductor device or lead that has been subjected to second bonding with a bonding tool. In a wire bonding apparatus that cuts a wire by shearing with an edge of ，
a Y, Z moving device; a rotation device that relatively rotates the holding frame and the bonding tool around an axis in the Z direction; and a detection device that detects bonding positions of the semiconductor device and the lead. a drive device that drives the X, Y, Z moving device and the rotation device according to the detected value, and a wire cutting edge position of the semiconductor device or lead subjected to second bonding is calculated based on the detected value. and a calculation device that drives the X, Y, Z moving device according to the calculated value to cause a shearing operation to the semiconductor device or lead subjected to the second bonding and the edge of the bonding tool to cut the wire. An object of the present invention is to provide a wire bonding device characterized by comprising a drive device.
本発明は、上述の構成を備えているので、第１
ボンデイング位置及び第２ボンデイング位置を自
動的に検出し、該検出値に基づいてボンデイング
ツール及び保持フレームをボンデイングのために
相対的に移動させ、ボンデイングを行うことがで
きる。
Since the present invention has the above-mentioned configuration, the first
Bonding can be performed by automatically detecting the bonding position and the second bonding position, and relatively moving the bonding tool and the holding frame for bonding based on the detected values.
また、その第１、第２ボンデイング位置の検出
値に基づいてワイヤ切断エツジ位置を算出し、該
算出値に基づいてボンデイングツール及び保持フ
レームをワイヤ切断のために相対的に移動させ、
ワイヤ切断を行うことができる。 Further, the wire cutting edge position is calculated based on the detected values of the first and second bonding positions, and the bonding tool and the holding frame are relatively moved for wire cutting based on the calculated value,
Can perform wire cutting.
本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described using the drawings.
第１図において、基板としてのパツケージ１を
固定して支える保持フレームとしての固定台２は
回転装置であるθテーブル３に載置されている。
ボンデイングヘツド４は互いに直角なＸ，Ｙ方向
に移動するＸ，Ｙ移動装置であるＸ，Ｙテーブル
５に載置され、ボンデイングツール（以下ツール
と略）６をＸ，Ｙ方向に直角のＺ方向に移動する
移動装置７によりＺ方向移動可能に備えている。 In FIG. 1, a fixing base 2 serving as a holding frame that fixes and supports a package 1 serving as a substrate is placed on a θ table 3 that is a rotating device.
The bonding head 4 is placed on an X, Y table 5, which is an X, Y moving device that moves in the X, Y directions perpendicular to each other, and moves a bonding tool (hereinafter abbreviated as the tool) 6 in the Z direction, perpendicular to the X, Y directions. It is provided so as to be movable in the Z direction by a moving device 7 that moves in the direction shown in FIG.
固定台２の上方には検出カメラ８が備えられ、
該検出カメラ８は認識ユニツト９に、認識ユニツ
ト９は演算・補正コントロール部１０に連絡され
ている。そして該コントロール部１０はボンデイ
ング位置を算出し、またその算出したボンデイン
グ位置に基づいてワイヤ切断位置を算出してＸ，
Ｙテーブル５，Ｚ移動装置７，θテーブル３の各
駆動装置に所要の駆動信号を出すようになつてい
て、検出カメラ８、認識ユニツト９、コントロー
ル部１０は検出装置及び算出装置を形成してい
る。 A detection camera 8 is provided above the fixed base 2,
The detection camera 8 is connected to a recognition unit 9, and the recognition unit 9 is connected to a calculation/correction control section 10. Then, the control unit 10 calculates the bonding position, and also calculates the wire cutting position based on the calculated bonding position, and
A required drive signal is output to each drive device of the Y table 5, Z moving device 7, and θ table 3, and the detection camera 8, recognition unit 9, and control section 10 form a detection device and a calculation device. There is.
Ｘ，Ｙテーブル５は、その駆動装置により、ツ
ール６先端を第１ボンデイングの位置に合わせ、
第１ボンデイング終了後は第２ボンデイングの位
置まで移動させ（このときワイヤはフリー状態）、
第２ボンデイングを終了した後は第２ボンデイン
グ位置のエツジにツール６のエツジを合わせるよ
うにボンデイングヘツド４を動かすようになつて
いる。 The X, Y table 5 uses its drive device to align the tip of the tool 6 to the first bonding position,
After the first bonding is completed, move it to the second bonding position (at this time, the wire is in a free state),
After completing the second bonding, the bonding head 4 is moved so that the edge of the tool 6 is aligned with the edge of the second bonding position.
Ｚ移動装置７はその駆動装置により、ボンデイ
ングに所要の上下動及びワイヤ切断に所要の上下
動をツール６に与えるようになつている。 The Z moving device 7 uses its drive device to give the tool 6 the vertical movement required for bonding and the vertical movement required for wire cutting.
θテーブル３は、その駆動装置により第１ボン
デイング位置と第２ボンデイング位置とを結ぶ直
線がＸ軸に平行になるように固定台２を回転させ
るようになつている。 The θ table 3 is configured to rotate the fixed base 2 by its driving device so that the straight line connecting the first bonding position and the second bonding position becomes parallel to the X axis.
ボンデイングツール６はアルミ線などのボンデ
イングに用いる超音波ウエツジボンデイング用の
ウエツジである。 The bonding tool 6 is an ultrasonic wedge bonding wedge used for bonding aluminum wire and the like.
次にボンデイング動作の一例を経過説明する。
パツケージ１は半導体装置としてのICチツプ１
１及びポスト状のリード１２，１３を固着された
後、自動供給機構（図示せず）により固定台２上
に載置される。ICチツプ１１及びリード１２，
１３のパツケージ１への取付はパツケージ１に対
して誤差があり、パツケージ１の固定台２への固
定にも誤差が生じている。 Next, an example of the bonding operation will be explained.
Package 1 is IC chip 1 as a semiconductor device.
1 and post-shaped leads 12 and 13 are fixed, and then placed on the fixing table 2 by an automatic feeding mechanism (not shown). IC chip 11 and lead 12,
There is an error in attaching the package 13 to the package 1, and there is also an error in fixing the package 1 to the fixing base 2.
ICチツプ１１にはリード１２との間でワイヤ
ボンデイングを行うターミナル１４とリード１３
との間でワイヤボンデイングを行うターミナル１
５が設けられている。ターミナル１４，１５の
ICチツプ１１への取付もICチツプ１１に対して
誤差がある。 The IC chip 11 has a terminal 14 and a lead 13 for wire bonding with the lead 12.
Terminal 1 performs wire bonding between
5 is provided. terminals 14 and 15
The mounting on the IC chip 11 also has an error with respect to the IC chip 11.
先ず、ターミナル１４及びリード１２の位置を
検出する。 First, the positions of the terminal 14 and lead 12 are detected.
ターミナル１４Ａ，１５Ａを標準位置に且つ標
準方向を向けて備えたICチツプ１１Ａとリード
１２Ａ，１３Ａが標準位置に且つ標準方向を向け
てパツケージ１Ａに取付けられ、そのパツケージ
１Ａが固定台２に標準位置に且つ標準方向を向け
て載置されているときの状態を第２図に２点鎖線
で示す。 The IC chip 11A with the terminals 14A and 15A in the standard position and pointing in the standard direction, and the leads 12A and 13A are installed in the package 1A with the terminals 14A and 15A in the standard position and facing in the standard direction, and the package 1A is placed in the standard position on the fixing base 2. FIG. 2 shows the state in which the device is placed facing the standard direction with a two-dot chain line.
予め座標がわかつているターミナル１４Ａ，リ
ード１２Ａのそれぞれの付近の視野をブラウン管
上に投影してその画面に含まれているターミナル
１４、リード１２の画像を輝度の変化などにより
パターン認識を行つてターミナル１４、リード１
２の中心の座標を求める。 The field of view near each of the terminals 14A and leads 12A, the coordinates of which are known in advance, is projected onto a cathode ray tube, and the images of the terminals 14 and leads 12 included in the screen are pattern-recognized based on changes in brightness, etc. 14, lead 1
Find the coordinates of the center of 2.
得られたターミナル１４とリード１２の中心の
座標から、ターミナル１４とポスト１２を結ぶ直
線（ボンデイング線と呼ぶ）BLのＸ軸との交角
θを求める。 From the obtained coordinates of the centers of the terminal 14 and the lead 12, the intersection angle θ of the straight line (referred to as a bonding line) BL connecting the terminal 14 and the post 12 with the X axis is determined.
そして、θテーブル３をその交角θだけ回転さ
せてボンデイング線BLをＸ軸に平行とする。他
方、Ｙテーブルを動かしてツール６をボンデイン
グ線BL上に移動させる。 Then, the θ table 3 is rotated by the intersection angle θ to make the bonding line BL parallel to the X axis. On the other hand, move the Y table to move the tool 6 onto the bonding line BL.
その状態でのターミナル１４とリード１２の中
心の座標を演算により求め、第３図のようにツー
ル６をＸテーブルによりターミナル１４の中心点
上方に移動させ、第１ボンデイングを行う。その
後ツール６をリード１２の中心点上方に移動さ
せ、第２ボンデイングを行う。 In this state, the coordinates of the center of the terminal 14 and the lead 12 are calculated, and the tool 6 is moved above the center point of the terminal 14 using the X table as shown in FIG. 3 to perform the first bonding. Thereafter, the tool 6 is moved above the center point of the lead 12 to perform second bonding.
次にワイヤ切断を行うが、リード１２の周縁線
とボンデイング線BLの２つの交点のうち、ター
ミナル１４から遠い方の交点が切断用のリードエ
ツジ１６となるので、これも自動的に行うことが
できる。この例ではリード１２の表面が円形なの
で、その径さえわかればボンデイングの際に求め
たターミナル１４、リード１２の座標からリード
エツジ１６の座標を演算により求めることができ
る。リード１２の表面が円形でない場合はリード
１２が第２図においてリード１２Ａと同一の標準
方向を向いていればリード１２の周縁線を示す数
式さえわかれば円形のものと同様に既に得られた
数値によりリードエツジ１６の座標を求めること
ができるが、リード１２がリード１２Ａと同じ方
向を向いていず、ズレているときはズレ角を公知
の手段により求めてリードエツジ１６の座標を求
めなければならない。 Next, the wire is cut, but of the two intersections between the peripheral line of the lead 12 and the bonding line BL, the intersection farther from the terminal 14 becomes the lead edge 16 for cutting, so this can also be done automatically. . In this example, the surface of the lead 12 is circular, so if the diameter is known, the coordinates of the lead edge 16 can be calculated from the coordinates of the terminal 14 and the lead 12 determined during bonding. If the surface of the lead 12 is not circular, and if the lead 12 faces in the same standard direction as the lead 12A in FIG. The coordinates of the lead edge 16 can be determined by using the method shown in FIG.
そして第４図に示すようにリードエツジ１６上
方にツール６のツールエツジ１７を移動させて、
所要量Ｚ移動装置７によりツール６を下降させれ
ばワイヤはせん断により切断される。 Then, as shown in FIG. 4, move the tool edge 17 of the tool 6 above the lead edge 16,
When the tool 6 is lowered by the required amount Z moving device 7, the wire is cut by shearing.
ターミナル１５とリード１３の間のワイヤボン
デイングも上述と同様な動作で行われ、第５図に
示すようにボンデイング作業が完了する。 Wire bonding between the terminal 15 and the lead 13 is performed in the same manner as described above, and the bonding work is completed as shown in FIG.
以上、固定台２を回転させ、ツール６をＸ，
Ｙ，Ｚ方向に移動させたが、回転及びＸ，Ｙ，Ｚ
方向移動は固定台２とツール６との間で相対的に
行えばよい。 As described above, rotate the fixed base 2 and move the tool 6 to
Although it was moved in the Y, Z direction, rotation and X, Y, Z
Directional movement may be performed relatively between the fixed base 2 and the tool 6.
本発明は、基板上に固設した半導体装置とリー
ドとをワイヤでボンデイングし、第２ボンデイン
グを施された半導体装置又はリードのエツジとボ
ンデイングツールのエツジとでワイヤをせん断に
より切断する、ワイヤボンデイング装置におい
て、前記基板を保持する保持フレームと、該保持
フレームと前記ボンデイングツールとを互いに直
角なＸ，Ｙ，Ｚ方向に相対的に移動させるＸ，
Ｙ，Ｚ移動装置と、前記保持フレームと前記ボン
デイングツールとをＺ方向の軸のまわりに相対的
に回動せしめる回転装置と、前記半導体装置と前
記リードのそれぞれのボンデイング位置を検出す
る検出装置とを備え、前記検出値に応じて前記
Ｘ，Ｙ，Ｚ移動装置と回転装置とを駆動する駆動
装置と、前記検出値により第２ボンデイングを施
された半導体装置又はリードのワイヤ切断エツジ
位置を算出する算出装置と、該算出値に応じて前
記Ｘ，Ｙ，Ｚ移動装置を駆動し、前記第２ボンデ
イングを施された半導体装置又はリードとボンデ
イングツールのエツジにせん断動作をせしめてワ
イヤを切断する駆動装置とを、備えたことを特徴
とするワイヤボンデイング装置を提供することが
できるので、ボンデイング作業を安定化、効率化
でき、従つて生産数の向上、コストダウンを図る
ことができる。
The present invention is a wire bonding method in which a semiconductor device fixed on a substrate and a lead are bonded with a wire, and the wire is cut by shearing between the edge of the second bonded semiconductor device or lead and the edge of a bonding tool. In the apparatus, a holding frame for holding the substrate, and an X for moving the holding frame and the bonding tool relatively in X, Y, and Z directions perpendicular to each other;
a Y, Z moving device; a rotation device that relatively rotates the holding frame and the bonding tool around an axis in the Z direction; and a detection device that detects bonding positions of the semiconductor device and the lead. a drive device that drives the X, Y, Z moving device and the rotation device according to the detected value, and a wire cutting edge position of the semiconductor device or lead subjected to second bonding is calculated based on the detected value. and a calculation device that drives the X, Y, Z moving device according to the calculated value to cause a shearing operation to the semiconductor device or lead subjected to the second bonding and the edge of the bonding tool to cut the wire. Since it is possible to provide a wire bonding apparatus characterized in that it is equipped with a drive device, bonding work can be stabilized and made more efficient, and therefore production volume can be increased and costs can be reduced.
第１図は本発明の実施例の正面図、第２図はパ
ツケージの拡大図、第３図及び第４図は動作説明
の縦断面正面図、第５図はボンデイング終了後の
パツケージの斜面図である。
１……パツケージ、２……固定台、３……θテ
ーブル、４……ボンデイングヘツド、５……Ｘ，
Ｙテーブル、６……ツール、７……Ｚ移動装置、
８……検出カメラ、９……認識ユニツト、１０…
…演算・補正コントロール部、１１……ICチツ
プ、１２……リード、１３……リード、１４……
ターミナル、１５……ターミナル、１６……リー
ドエツジ、１７……ツールエツジ。
Fig. 1 is a front view of an embodiment of the present invention, Fig. 2 is an enlarged view of the package, Figs. 3 and 4 are longitudinal sectional front views for explaining the operation, and Fig. 5 is a slope view of the package after bonding is completed. It is. 1...Package cage, 2...Fixing base, 3...θ table, 4...Bonding head, 5...X,
Y table, 6...tool, 7...Z moving device,
8...Detection camera, 9...Recognition unit, 10...
...Calculation/correction control section, 11...IC chip, 12...Lead, 13...Lead, 14...
Terminal, 15...Terminal, 16...Lead Edge, 17...Tool Edge.
Claims (1)
イヤでボンデイングし、第２ボンデイングを施さ
れた半導体装置又はリードのエツジとボンデイン
グツールのエツジとでワイヤをせん断による切断
する、ワイヤボンデイング装置において、 前記基板を保持する保持フレームと、 該保持フレームと前記ボンデイングツールとを
互いに直角なＸ，Ｙ，Ｚ方向に相対的に移動させ
るＸ，Ｙ，Ｚ移動装置と、 前記保持フレームと前記ボンデイングツールと
をＺ方向の軸のまわりに相対的に回動せしめる回
転装置と、 前記半導体装置と前記リードのそれぞれのボン
デイング位置を検出する検出装置とを備え、 前記検出値に応じて前記Ｘ，Ｙ，Ｚ移動装置と
回転装置とを駆動する駆動装置と、 前記検出値により第２ボンデイングを施された
半導体装置又はリードのワイヤ切断エツジ位置を
算出する算出装置と、 該算出値に応じて前記Ｘ，Ｙ，Ｚ移動装置を駆
動し、前記第２ボンデイング施された半導体装置
又はリードとボンデイングツールのエツジにせん
断動作をせしめてワイヤを切断する駆動装置と
を、 備えたことを特徴とするワイヤボンデイング装
置。[Claims] 1. A semiconductor device fixed on a substrate and a lead are bonded with a wire, and the wire is cut by shearing between the edge of the second bonded semiconductor device or lead and the edge of the bonding tool. , a wire bonding apparatus, comprising: a holding frame that holds the substrate; an X, Y, and Z moving device that relatively moves the holding frame and the bonding tool in X, Y, and Z directions perpendicular to each other; and the holding frame. a rotation device that relatively rotates the frame and the bonding tool around an axis in the Z direction; and a detection device that detects bonding positions of the semiconductor device and the lead, according to the detected values. a driving device that drives the X, Y, Z moving device and the rotating device; a calculating device that calculates the wire cutting edge position of the semiconductor device or lead subjected to second bonding based on the detected value; and a driving device that drives the X, Y, Z moving device in response to the second bonding and causes the second bonded semiconductor device or lead and the edge of the bonding tool to perform a shearing operation to cut the wire. wire bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61268580A JPS63124430A (en) | 1986-11-13 | 1986-11-13 | Wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61268580A JPS63124430A (en) | 1986-11-13 | 1986-11-13 | Wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63124430A JPS63124430A (en) | 1988-05-27 |
| JPH0455529B2 true JPH0455529B2 (en) | 1992-09-03 |
Family
ID=17460497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61268580A Granted JPS63124430A (en) | 1986-11-13 | 1986-11-13 | Wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124430A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5109147A (en) * | 1990-05-09 | 1992-04-28 | Applied Magnetics Corporation | Soldering tip for magnetic wire hookup |
-
1986
- 1986-11-13 JP JP61268580A patent/JPS63124430A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63124430A (en) | 1988-05-27 |
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