JPS6032978B2 - Manufacturing method of semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a semiconductor device in which a semiconductor device package equipped with a metal seal frame is hermetically sealed with a metal cap, and particularly a method of hermetically sealing a semiconductor device package with a sealing roll electrode. It is related to.

Conventionally, the sealing method for a ceramic package with a square seal frame (called a square seam weld case) is as follows:
It was called the parallel seam weld method, in which a square seam weld case reciprocated and rotated 900 times between opposing roll electrodes with the same axis.

The roll electrode used in this method had a roll portion having a conical taper structure, a short width of the taper portion, and a taper angle of approximately 300 degrees. The disadvantages of this parallel seam welding method are that the sealing speed is slow and sparks are likely to occur between the roll portion and the cap, which causes a decrease in the sealing yield and reliability of the package. In order to explain the present invention, a conventional roll electrode structure and its sealing method will be explained with reference to the drawings. FIGS. 1a and 1b are a perspective view and a side view of the roll portion of a conventional roll electrode. Figure 2 is a diagram explaining the sealing method using conventional roll electrodes.
b is its plan view, and c and d are its side views. The sealing method shown in FIG. 2 is called a parallel seam weld method, and first, as shown in FIGS. .

Next, the conical taper roll parts 1 facing each other with the same axis center
is lowered while applying a pulse current to the metal cap, the roll part is brought into contact with the outermost edge of the metal cap, the rotary table 2 is moved linearly in the direction of arrow A, and the long side of the seal frame 5 is moved while the roll part 1 rotates. to weld. After welding the long sides,
When the tapered roll part 1 is separated from the metal cap 4, the air cylinder is operated to rotate the rotary table 2 by 900 revolutions, and the ceramic package is placed in the position shown in Figures b and d. Next, the rotary table 2 moves in the direction of arrow B to weld the short sides of the seal frame. The above is a conventional method for sealing a rectangular seam weld case using the parallel seam weld method. As described above, in the parallel seam welding method, since the seal part moves linearly, it is sufficient to perform seam welding if the width W of the roll part shown in Fig. 1b is about 1 to 2 sides. It was set at an angle of around 8G or 300 degrees. However, cap sealing by the parallel seam welding method using the roll electrode described above has two major drawbacks.

First of all, when the ceramic package and the metal cap reciprocate, sparks are generated the moment the roll part leaves the metal cap, causing excessive melting of the cap edge part or the tapered roll surface of the electrode, making the ceramic package airtight. This deteriorates the performance and electrical characteristics of the semiconductor device, and therefore, maintenance of the roll electrode is not easy. Second, the sealing speed cannot be increased because the rotary table makes reciprocating and rotational movements, and because sparks are to be avoided as much as possible. The present invention relates to a method for manufacturing a semiconductor device using a roll electrode that eliminates the above-mentioned drawbacks, improves the manufacturing yield and reliability of the semiconductor device, and enables highly efficient sealing.

The roll electrode according to the present invention enables welding by only rotating motion around the seal frame of a semiconductor device package mounted on a rotary table, without reciprocating the square seam weld case as in the conventional method. It is a roll electrode. In other words, the roll portion of the roll electrode of the present invention has a length sufficient to maintain contact with the seal frame without coming off even when the package having the rectangular seal frame fixed approximately at the center of the rotary table rotates 3,600 times. It is a right cylindrical shape. Furthermore, the upper part of the pillar for supporting the roll part is fixed to the seam welding machine main body, and the pillar is lowered vertically, and the roll part is installed in the bearing hole provided at the lower end of the pillar at a slight angle with respect to the horizontal. The cap-sealing roll electrode of the present invention is constructed in this way. The roll electrode of the present invention enables welding of seal frames having not only circular, rectangular, and square shapes but also elliptical shapes or complicated curved shapes by narrowing the roll portion into a cylindrical shape. Next, embodiments of the present invention will be described using the drawings.

Fig. 3 is a perspective view of the roll part of the roll electrode of the present invention;
5 are explanatory drawings for determining the dimensions of the roll portion of the roll electrode of the present invention, respectively.

The structure of the roll part of the roll electrode of the present invention is as shown in FIG.
It is a right circular cylinder with a diameter of W and a width of W. In other words, if the seal frame and metal cap are square with one side a as shown in Figure 4a, when the ceramic package is rotated around the center 0 of the square, the four sides of the square will fall within a circle with a radius of maximum OP and minimum OA. It fits in. In other words, the minimum width of the roll part is OP-OA=AQ(W). If we consider the margin of Q and calculate it, we get W = year 2 a + Q.

If the metal cap and seal frame are rectangular axb as shown in Fig. 4b, the width W of the roll portion is W(AQ') = OP' - OA' 2 - a +
It becomes Q.

Figure 5 is an explanatory diagram for determining the roll width W of a seal frame with a complicated curve.The seal frame with a complicated curve is placed approximately at the center of the rotary table center ○ and rotated around ○. If there is a roll part width W that takes into account the margin Q for the distance difference (OR-OS) between the farthest position R and the closest position S, a complex-shaped seam weld can be achieved.

Specifically, the width W of the roll part is 5. If the roll part width W is a square seal frame with 2 ribs on each side, the roll width W is 5 willows, and if the roll part width W is a rectangular seal frame with 2 ribs x 3 ribs. A roll width W of 9 to IQ is sufficient. The diameter d is generally used for sealing a seam weld case on the 5th or 6th side, but the diameter d varies depending on the size of the seal frame. Next, in the embodiment of the present invention shown in FIGS. 6 and 7, the support to which the roll part 8 is attached will be explained. The bearing hole of the roll portion 8 is provided at an angle of 1 to 10 degrees with respect to the horizontal.

The purpose of the bearing hole provided at the tip of the support is to provide an inclination angle of 1 to 10 degrees with respect to the horizontal when the roll portion 8 of the right circular column is installed in the bearing hole. The purpose of this inclination angle is to give the roll surface of the right cylindrical roll part of the present invention a bevel, similar to the conventionally used conical taper roll part. The support column 7 has a structure in which it can be moved up and down by a spring as in the conventional case, so that it can absorb minute displacements of the roll portion. In addition, when the roll parts 8 are faced to each other as shown in Fig. 6, a 4-type package,
The structure in which the roll portions 8 are placed back to back as shown in FIG. 7 is convenient for sealing large packages. Next, Figure 8a,
The sealing method using a roll electrode of the present invention will be explained using figures b, c, and d.

However, the branch office of the roll electrode is not shown. As shown in figures a and c, the ceramic package 3 is fixed on the rotary table 2,
A metal cap 4 is placed on a sealing frame 5.

Next, the facing roll parts 8 of the roll electrodes of the present invention are lowered and brought into contact with the long edges of the metal cap 4, and then a pulse current is applied, and the rotary table 2 is rotated over 180 degrees to complete welding. . Figures b and d show the state of contact between the metal cap 4 and the roll portion 8 when the rotary table 2 has been rotated 900 times, and the electrode is raised after welding is completed.

During welding, a rectangular cap is welded by moving the contact portion between the cap edge and the roll portion.
The electrode of the present invention has a uniform diameter because the roll part is not tapered, and if it has a thickness of 2 to 3 willows, it can follow complex curved shapes and weld seal frames. be.

As stated above, the present invention is a right circular cylinder. By using the roll portion with an inclination, the ceramic package can be hermetically sealed by simply rotating the turntable by approximately 180 degrees, thereby improving work efficiency. Moreover, it is applicable not only to ceramic packages but also to all packages equipped with metal seal frames.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 a, b is a perspective view and a side view showing the roll part of a conventional roll electrode, respectively, and Fig. 2 a, b, c, and d are explanatory diagrams of a conventional sealing method, respectively. , FIG. 3 is a perspective view of the roll portion of the roll electrode of the present invention, FIGS. 4 and 5 are explanatory diagrams for determining the dimensions of the roll portion of the roll electrode of the present invention, and FIGS. 6 and 7 are diagrams, respectively. 8a, b, c, and d are side views showing embodiments of the present invention, respectively, and are explanatory diagrams of a sealing method using a roll electrode of the present invention. DESCRIPTION OF SYMBOLS 1... Taper roll part, 2... Turntable, 3... Ceramic package, 4... Metal cap, 5... Seal frame, 6... Support part, 7... Support column, 8...・
Cylindrical roll part. Figure 1 Figure 2 Figure 3 Figure 4 Haircut Figure 6 Haircut Figure 8

Claims (1)

[Claims] 1. In a method for manufacturing a semiconductor device in which a semiconductor device package is hermetically sealed using a metal cap, the semiconductor device package and the metal cap are arranged symmetrically about the rotation axis of a rotary table on which the metal cap is placed horizontally, and A method for manufacturing a semiconductor device, characterized in that the semiconductor device is hermetically sealed using a sealing roll electrode having a pair of cylindrical roll portions that are pivotably supported at an angle and that contact the edges of the metal cap.