JPS5343478A - Roll electrode for cap sealing of semiconductor device - Google Patents

Roll electrode for cap sealing of semiconductor device

Info

Publication number
JPS5343478A
JPS5343478A JP11818676A JP11818676A JPS5343478A JP S5343478 A JPS5343478 A JP S5343478A JP 11818676 A JP11818676 A JP 11818676A JP 11818676 A JP11818676 A JP 11818676A JP S5343478 A JPS5343478 A JP S5343478A
Authority
JP
Japan
Prior art keywords
semiconductor device
cap sealing
roll electrode
parts
roll
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11818676A
Other languages
Japanese (ja)
Other versions
JPS6032978B2 (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11818676A priority Critical patent/JPS6032978B2/en
Publication of JPS5343478A publication Critical patent/JPS5343478A/en
Publication of JPS6032978B2 publication Critical patent/JPS6032978B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Package Closures (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)

Abstract

PURPOSE: To weld a seal frame of intricately curved shape only by rotating motion by inclining true cylindrical roll parts in using said parts.
COPYRIGHT: (C)1978,JPO&Japio
JP11818676A 1976-09-30 1976-09-30 Manufacturing method of semiconductor device Expired JPS6032978B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11818676A JPS6032978B2 (en) 1976-09-30 1976-09-30 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11818676A JPS6032978B2 (en) 1976-09-30 1976-09-30 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5343478A true JPS5343478A (en) 1978-04-19
JPS6032978B2 JPS6032978B2 (en) 1985-07-31

Family

ID=14730267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11818676A Expired JPS6032978B2 (en) 1976-09-30 1976-09-30 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6032978B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985118A (en) * 1987-03-24 1991-01-15 Konica Corporation Method for treating photographic process waste liquor through concentration by evaporation
US5004522A (en) * 1986-12-03 1991-04-02 Konica Corporation Method of treating photographic process waste liquor through concentration by evaporation
CN103056500A (en) * 2012-11-30 2013-04-24 北京时代民芯科技有限公司 Welding method for semiconductor ceramic shell sealing cap

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004522A (en) * 1986-12-03 1991-04-02 Konica Corporation Method of treating photographic process waste liquor through concentration by evaporation
US4985118A (en) * 1987-03-24 1991-01-15 Konica Corporation Method for treating photographic process waste liquor through concentration by evaporation
CN103056500A (en) * 2012-11-30 2013-04-24 北京时代民芯科技有限公司 Welding method for semiconductor ceramic shell sealing cap

Also Published As

Publication number Publication date
JPS6032978B2 (en) 1985-07-31

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