JPS56129346A - Apparatus for welding seam - Google Patents

Apparatus for welding seam

Info

Publication number
JPS56129346A
JPS56129346A JP17211180A JP17211180A JPS56129346A JP S56129346 A JPS56129346 A JP S56129346A JP 17211180 A JP17211180 A JP 17211180A JP 17211180 A JP17211180 A JP 17211180A JP S56129346 A JPS56129346 A JP S56129346A
Authority
JP
Japan
Prior art keywords
cap
electrodes
contact
welded
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17211180A
Other languages
Japanese (ja)
Other versions
JPS6250227B2 (en
Inventor
Masami Kiyono
Toshikazu Oshino
Toshiro Iba
Mitsuyoshi Oyama
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17211180A priority Critical patent/JPS56129346A/en
Publication of JPS56129346A publication Critical patent/JPS56129346A/en
Publication of JPS6250227B2 publication Critical patent/JPS6250227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Abstract

PURPOSE:To improve the efficiency of sealing work by an apparatus wherein welded material is rotated while making a pair of electrodes in contact with the welded material and a distance between the paired electrodes is varied with the rotation. CONSTITUTION:A package body 1 is fixed onto a table 3 and a rectangular cap 2 is superimposed on the body 1 to be fixed. Then, a pair of electrodes 5, 6 are contacted with the longer sides of the cap 2, for example. After the contact, voltage is applied between the electrodes 5, 6 and the contact portions of the cap 2 with the body 1 are welded. While applying the voltage, the table 3 is half-turned so that all contact peripheral portions between the cap 2 and the body 1 can be welded. Upon the end of sealing, the electrodes 5, 6 are separated from the cap 2. In this case, the electrodes 5, 6 move along only the X axis and coordinates at the periphery of the cap 2 intersecting with the X axis are varied from time to time with the rotation of the cap 2 in the direction shown by an arrow. To accomplish this, control motors 12, 13 are so controlled that the electrodes 5, 6 are made in contact with the outer periphery of the cap 2 at all time.
JP17211180A 1980-12-08 1980-12-08 Apparatus for welding seam Granted JPS56129346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17211180A JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14503975A Division JPS5268837A (en) 1975-12-08 1975-12-08 Atmospheric seam welding process

Publications (2)

Publication Number Publication Date
JPS56129346A true JPS56129346A (en) 1981-10-09
JPS6250227B2 JPS6250227B2 (en) 1987-10-23

Family

ID=15935751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17211180A Granted JPS56129346A (en) 1980-12-08 1980-12-08 Apparatus for welding seam

Country Status (1)

Country Link
JP (1) JPS56129346A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006341302A (en) * 2005-06-10 2006-12-21 Origin Electric Co Ltd Method and device for seam joining

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006341302A (en) * 2005-06-10 2006-12-21 Origin Electric Co Ltd Method and device for seam joining

Also Published As

Publication number Publication date
JPS6250227B2 (en) 1987-10-23

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