JPS56128680A - Seam welding device - Google Patents

Seam welding device

Info

Publication number
JPS56128680A
JPS56128680A JP17211280A JP17211280A JPS56128680A JP S56128680 A JPS56128680 A JP S56128680A JP 17211280 A JP17211280 A JP 17211280A JP 17211280 A JP17211280 A JP 17211280A JP S56128680 A JPS56128680 A JP S56128680A
Authority
JP
Japan
Prior art keywords
cap
electrodes
outside equipment
main body
equipment main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17211280A
Other languages
Japanese (ja)
Other versions
JPS5744437B2 (en
Inventor
Masami Kiyono
Toshikazu Oshino
Toshiro Iba
Mitsuyoshi Oyama
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17211280A priority Critical patent/JPS56128680A/en
Publication of JPS56128680A publication Critical patent/JPS56128680A/en
Publication of JPS5744437B2 publication Critical patent/JPS5744437B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To subject the outside equipment and the cap to resistance welding completely in a short time without weld defects and appearance defects, by bringing a pair of taper electrodes into contact with the cap and by supplying power while rotating it, for welding between the outside equipment for semiconductor element and the cap.
CONSTITUTION: Outside equipment main body 1 incorporating the semiconductor element and so on is fixed onto rotary table 3. After cap 2 is overlapped onto outside equipment main body 1 and is fixed, a pair of electrodes 5 and 6 of the conical roller form are brought into contact with cap 2. A voltage is applied to both electrodes 5 and 6 to weld the contact part between cap 2 and outside equipment main body 1 due to resistance heating. Table 3 is rotated half simultaneously with applying of the voltage to weld all of circumferences of cap 2 and outside equipment main body 1. In this case, the cap edge part moves vertically along the taper part of electrodes 5 and 6 to adjust the interval between electrodes 5 and 6 automatically, and thus, welding superior in appearance is performed without generation of the arc.
COPYRIGHT: (C)1981,JPO&Japio
JP17211280A 1980-12-08 1980-12-08 Seam welding device Granted JPS56128680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17211280A JPS56128680A (en) 1980-12-08 1980-12-08 Seam welding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17211280A JPS56128680A (en) 1980-12-08 1980-12-08 Seam welding device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14503975A Division JPS5268837A (en) 1975-12-08 1975-12-08 Atmospheric seam welding process

Publications (2)

Publication Number Publication Date
JPS56128680A true JPS56128680A (en) 1981-10-08
JPS5744437B2 JPS5744437B2 (en) 1982-09-21

Family

ID=15935768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17211280A Granted JPS56128680A (en) 1980-12-08 1980-12-08 Seam welding device

Country Status (1)

Country Link
JP (1) JPS56128680A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551745A (en) * 1981-09-30 1985-11-05 Fujitsu Limited Package for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551745A (en) * 1981-09-30 1985-11-05 Fujitsu Limited Package for semiconductor device

Also Published As

Publication number Publication date
JPS5744437B2 (en) 1982-09-21

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