JPS558086A - Method of airtight sealing of semiconductor device vessel - Google Patents

Method of airtight sealing of semiconductor device vessel

Info

Publication number
JPS558086A
JPS558086A JP8131678A JP8131678A JPS558086A JP S558086 A JPS558086 A JP S558086A JP 8131678 A JP8131678 A JP 8131678A JP 8131678 A JP8131678 A JP 8131678A JP S558086 A JPS558086 A JP S558086A
Authority
JP
Japan
Prior art keywords
cap
turning
roller
electrodes
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8131678A
Other languages
Japanese (ja)
Other versions
JPS6052581B2 (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8131678A priority Critical patent/JPS6052581B2/en
Publication of JPS558086A publication Critical patent/JPS558086A/en
Publication of JPS6052581B2 publication Critical patent/JPS6052581B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Sealing Battery Cases Or Jackets (AREA)
  • Resistance Welding (AREA)

Abstract

PURPOSE: To avoid a furned cap and an insufficient welding by energizing to the parallel electrodes making each opposite roller electrode two pararrel roller electrodes and by turning and sealing a cass.
CONSTITUTION: When a seam weld case 2 is fixed to a turning board and a cap 4 is positioned to a seam frame and a switch is turned on, two parallel roller electrodes 5 go down and the turning board with a push of the cap 4 and these two roller electrodes begin to be energized. Because short and long areas and corners of the cap are pressurized and always touched to the roll section of the roller electrode 5 while the turning board is turning, sealing is conducted not different from that of a round seam weld case. And due to a short distance between the roller electrode no influence of increased resistance is made and the burned cap and insufficient welding are avoided.
COPYRIGHT: (C)1980,JPO&Japio
JP8131678A 1978-07-03 1978-07-03 Hermetic sealing method for containers for semiconductor devices Expired JPS6052581B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8131678A JPS6052581B2 (en) 1978-07-03 1978-07-03 Hermetic sealing method for containers for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8131678A JPS6052581B2 (en) 1978-07-03 1978-07-03 Hermetic sealing method for containers for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS558086A true JPS558086A (en) 1980-01-21
JPS6052581B2 JPS6052581B2 (en) 1985-11-20

Family

ID=13742982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8131678A Expired JPS6052581B2 (en) 1978-07-03 1978-07-03 Hermetic sealing method for containers for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6052581B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310545A (en) * 1986-07-01 1988-01-18 Nec Corp Hermetic sealing of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310545A (en) * 1986-07-01 1988-01-18 Nec Corp Hermetic sealing of semiconductor device

Also Published As

Publication number Publication date
JPS6052581B2 (en) 1985-11-20

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