JPH0378783B2 - - Google Patents
Info
- Publication number
- JPH0378783B2 JPH0378783B2 JP7703388A JP7703388A JPH0378783B2 JP H0378783 B2 JPH0378783 B2 JP H0378783B2 JP 7703388 A JP7703388 A JP 7703388A JP 7703388 A JP7703388 A JP 7703388A JP H0378783 B2 JPH0378783 B2 JP H0378783B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- electrode
- contact
- curved surface
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 description 3
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7703388A JPH01248646A (ja) | 1988-03-30 | 1988-03-30 | 半導体装置の気密封止方法および気密封止用電極 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7703388A JPH01248646A (ja) | 1988-03-30 | 1988-03-30 | 半導体装置の気密封止方法および気密封止用電極 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01248646A JPH01248646A (ja) | 1989-10-04 |
JPH0378783B2 true JPH0378783B2 (enrdf_load_stackoverflow) | 1991-12-16 |
Family
ID=13622445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7703388A Granted JPH01248646A (ja) | 1988-03-30 | 1988-03-30 | 半導体装置の気密封止方法および気密封止用電極 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01248646A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103056500B (zh) * | 2012-11-30 | 2015-09-02 | 北京时代民芯科技有限公司 | 半导体陶瓷外壳封帽的焊接方法 |
-
1988
- 1988-03-30 JP JP7703388A patent/JPH01248646A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01248646A (ja) | 1989-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR920700832A (ko) | 전기 용접 로보트 및 그 로보트를 이용한 용접방법 | |
JPH0378783B2 (enrdf_load_stackoverflow) | ||
US5527992A (en) | Cavity down mounting seam-welding ceramic package for semiconductor device | |
JPH0378784B2 (enrdf_load_stackoverflow) | ||
JP2638413B2 (ja) | 抵抗溶接方法 | |
EP0915364A2 (en) | Rubbing apparatus and rubbing method for preparing orientation layers | |
JPH09277050A (ja) | ポジショナ一体型溶接ロボット | |
JPS6032978B2 (ja) | 半導体装置の製造方法 | |
CN1007853B (zh) | 通用封接 | |
JP2557087Y2 (ja) | シーム接合の仮止め用電極装置 | |
JPH0982440A (ja) | スリップリング | |
JP2500480B2 (ja) | シ―ム溶接機 | |
JPS6311234A (ja) | ワイヤ放電加工装置 | |
JPS5982752A (ja) | シ−ムウエルド装置 | |
JPS63249355A (ja) | 集積回路の外囲器 | |
JPH0982824A (ja) | 溶接装置 | |
JPS59145545A (ja) | 半導体装置用容器の気密封止法 | |
JPH0512919Y2 (enrdf_load_stackoverflow) | ||
JPH0569147A (ja) | 2電極回転トーチ | |
JPH0631458A (ja) | マイクロパラレルシーム接合装置 | |
JP2653405B2 (ja) | 半導体装置用パッケージ | |
JPH0431792B2 (enrdf_load_stackoverflow) | ||
JPH02108480A (ja) | 接点材料の溶接方法 | |
JP2016055329A (ja) | スポット溶接方法 | |
JPS5817707B2 (ja) | シ−ム溶接機の電極装置 |