JPH01248646A - 半導体装置の気密封止方法および気密封止用電極 - Google Patents
半導体装置の気密封止方法および気密封止用電極Info
- Publication number
- JPH01248646A JPH01248646A JP7703388A JP7703388A JPH01248646A JP H01248646 A JPH01248646 A JP H01248646A JP 7703388 A JP7703388 A JP 7703388A JP 7703388 A JP7703388 A JP 7703388A JP H01248646 A JPH01248646 A JP H01248646A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- electrodes
- contact
- electrode
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 15
- 238000003466 welding Methods 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 description 3
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7703388A JPH01248646A (ja) | 1988-03-30 | 1988-03-30 | 半導体装置の気密封止方法および気密封止用電極 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7703388A JPH01248646A (ja) | 1988-03-30 | 1988-03-30 | 半導体装置の気密封止方法および気密封止用電極 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01248646A true JPH01248646A (ja) | 1989-10-04 |
JPH0378783B2 JPH0378783B2 (enrdf_load_stackoverflow) | 1991-12-16 |
Family
ID=13622445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7703388A Granted JPH01248646A (ja) | 1988-03-30 | 1988-03-30 | 半導体装置の気密封止方法および気密封止用電極 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01248646A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103056500A (zh) * | 2012-11-30 | 2013-04-24 | 北京时代民芯科技有限公司 | 半导体陶瓷外壳封帽的焊接方法 |
-
1988
- 1988-03-30 JP JP7703388A patent/JPH01248646A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103056500A (zh) * | 2012-11-30 | 2013-04-24 | 北京时代民芯科技有限公司 | 半导体陶瓷外壳封帽的焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0378783B2 (enrdf_load_stackoverflow) | 1991-12-16 |
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