JPS6249243U - - Google Patents
Info
- Publication number
- JPS6249243U JPS6249243U JP14107785U JP14107785U JPS6249243U JP S6249243 U JPS6249243 U JP S6249243U JP 14107785 U JP14107785 U JP 14107785U JP 14107785 U JP14107785 U JP 14107785U JP S6249243 U JPS6249243 U JP S6249243U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pin
- lead
- semiconductor device
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14107785U JPS6249243U (US20020095090A1-20020718-M00002.png) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14107785U JPS6249243U (US20020095090A1-20020718-M00002.png) | 1985-09-13 | 1985-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249243U true JPS6249243U (US20020095090A1-20020718-M00002.png) | 1987-03-26 |
Family
ID=31048530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14107785U Pending JPS6249243U (US20020095090A1-20020718-M00002.png) | 1985-09-13 | 1985-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249243U (US20020095090A1-20020718-M00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360146A (ja) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | 樹脂モールド型半導体装置及び樹脂モールド装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745264A (en) * | 1980-08-30 | 1982-03-15 | Matsushita Electric Works Ltd | Manufacture of electronic part molded with resin |
| JPS6047429A (ja) * | 1983-08-25 | 1985-03-14 | Fujitsu Ltd | 樹脂パッケ−ジの成形金型 |
-
1985
- 1985-09-13 JP JP14107785U patent/JPS6249243U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745264A (en) * | 1980-08-30 | 1982-03-15 | Matsushita Electric Works Ltd | Manufacture of electronic part molded with resin |
| JPS6047429A (ja) * | 1983-08-25 | 1985-03-14 | Fujitsu Ltd | 樹脂パッケ−ジの成形金型 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0360146A (ja) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | 樹脂モールド型半導体装置及び樹脂モールド装置 |
