JPS6248968B2 - - Google Patents

Info

Publication number
JPS6248968B2
JPS6248968B2 JP58073195A JP7319583A JPS6248968B2 JP S6248968 B2 JPS6248968 B2 JP S6248968B2 JP 58073195 A JP58073195 A JP 58073195A JP 7319583 A JP7319583 A JP 7319583A JP S6248968 B2 JPS6248968 B2 JP S6248968B2
Authority
JP
Japan
Prior art keywords
group
parts
weight
formula
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58073195A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59197421A (ja
Inventor
Kunio Ito
Toshio Shiobara
Kazutoshi Tomyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP7319583A priority Critical patent/JPS59197421A/ja
Publication of JPS59197421A publication Critical patent/JPS59197421A/ja
Publication of JPS6248968B2 publication Critical patent/JPS6248968B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7319583A 1983-04-26 1983-04-26 硬化性エポキシ樹脂組成物 Granted JPS59197421A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7319583A JPS59197421A (ja) 1983-04-26 1983-04-26 硬化性エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7319583A JPS59197421A (ja) 1983-04-26 1983-04-26 硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59197421A JPS59197421A (ja) 1984-11-09
JPS6248968B2 true JPS6248968B2 (enrdf_load_stackoverflow) 1987-10-16

Family

ID=13511113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7319583A Granted JPS59197421A (ja) 1983-04-26 1983-04-26 硬化性エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59197421A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110212A (ja) * 1986-10-27 1988-05-14 Toshiba Chem Corp 封止用樹脂組成物
US5220047A (en) * 1990-09-17 1993-06-15 Union Carbide Chemicals & Plastics Technology Corporation Carbamate silicon compounds as latent coupling agents and process for preparation and use
JP4672135B2 (ja) * 2000-12-15 2011-04-20 旭化成イーマテリアルズ株式会社 アルコキシシラン化合物及び感光性樹脂組成物
DE102005026085A1 (de) 2005-06-07 2006-12-14 Construction Research & Technology Gmbh Silan-modifizierte Harnstoff-Derivate, Verfahren zu ihrer Herstellung und deren Verwendung als Rheologiehilfsmittel
JP5565220B2 (ja) * 2010-09-03 2014-08-06 横浜ゴム株式会社 湿気硬化型樹脂組成物
US10428176B2 (en) 2014-12-09 2019-10-01 Korea Institute Of Industrial Technology Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition and cured product comprising same, use thereof, and method for preparing alkoxysilyl compound
US12031013B2 (en) 2021-07-19 2024-07-09 Momentive Performance Materials Inc. Silane coupling agents to improve resin adhesion

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153357A (en) * 1979-05-18 1980-11-29 Hitachi Ltd Manufacturing method of resin sealed semiconductor device
JPS5657792A (en) * 1979-10-15 1981-05-20 Shin Etsu Chem Co Ltd Preparation of ureido group-containing alkoxysilane
JPS5679150A (en) * 1979-11-30 1981-06-29 Daikin Ind Ltd Epoxy composition containing fluorine
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition

Also Published As

Publication number Publication date
JPS59197421A (ja) 1984-11-09

Similar Documents

Publication Publication Date Title
JPS6248968B2 (enrdf_load_stackoverflow)
JPH0618985B2 (ja) エポキシ樹脂組成物
JPH06345847A (ja) エポキシ樹脂組成物及び半導体装置
US20100292400A1 (en) Curable Liquid Epoxy Resin Composition and Cured Product Thereof
JPH0747622B2 (ja) エポキシ樹脂組成物及びその硬化物
JPH0450925B2 (enrdf_load_stackoverflow)
WO2001010955A1 (fr) Composition de resine epoxy et dispositif a semi-conducteur
JPS58225121A (ja) エポキシ樹脂組成物及びそれを用いる電子部品の封止方法
JP3649524B2 (ja) エポキシ樹脂組成物および半導体装置
JPH0520447B2 (enrdf_load_stackoverflow)
CN119318014A (zh) 液态树脂组合物和树脂密封功率模块
TWI425048B (zh) 可固化環氧樹脂組合物、其固化體及其用途
JPS63226951A (ja) 樹脂封止型半導体装置
JP2560469B2 (ja) エポキシ系樹脂組成物
JP4618407B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH09235452A (ja) 半導体封止用エポキシ樹脂組成物
JPH07242799A (ja) 半導体封止用エポキシ樹脂組成物
JPS6228968B2 (enrdf_load_stackoverflow)
JP2001114994A (ja) エポキシ系樹脂組成物および半導体装置
JP2546121B2 (ja) 有機珪素化合物及びこの化合物を含むエポキシ樹脂組成物
JPH03134016A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH0977850A (ja) エポキシ樹脂組成物および樹脂封止型半導体装置
JP2541015B2 (ja) 半導体装置封止用エポキシ樹脂組成物及び半導体装置
JPS621609B2 (enrdf_load_stackoverflow)
JP2003138097A (ja) 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置