JPS624861B2 - - Google Patents
Info
- Publication number
- JPS624861B2 JPS624861B2 JP6778578A JP6778578A JPS624861B2 JP S624861 B2 JPS624861 B2 JP S624861B2 JP 6778578 A JP6778578 A JP 6778578A JP 6778578 A JP6778578 A JP 6778578A JP S624861 B2 JPS624861 B2 JP S624861B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- index
- lead
- leads
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6778578A JPS54159177A (en) | 1978-06-07 | 1978-06-07 | Resin sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6778578A JPS54159177A (en) | 1978-06-07 | 1978-06-07 | Resin sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54159177A JPS54159177A (en) | 1979-12-15 |
| JPS624861B2 true JPS624861B2 (cs) | 1987-02-02 |
Family
ID=13354951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6778578A Granted JPS54159177A (en) | 1978-06-07 | 1978-06-07 | Resin sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54159177A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
-
1978
- 1978-06-07 JP JP6778578A patent/JPS54159177A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54159177A (en) | 1979-12-15 |
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