JPS54159177A - Resin sealed semiconductor device - Google Patents
Resin sealed semiconductor deviceInfo
- Publication number
- JPS54159177A JPS54159177A JP6778578A JP6778578A JPS54159177A JP S54159177 A JPS54159177 A JP S54159177A JP 6778578 A JP6778578 A JP 6778578A JP 6778578 A JP6778578 A JP 6778578A JP S54159177 A JPS54159177 A JP S54159177A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- index
- sealing body
- resin sealing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6778578A JPS54159177A (en) | 1978-06-07 | 1978-06-07 | Resin sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6778578A JPS54159177A (en) | 1978-06-07 | 1978-06-07 | Resin sealed semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54159177A true JPS54159177A (en) | 1979-12-15 |
JPS624861B2 JPS624861B2 (ja) | 1987-02-02 |
Family
ID=13354951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6778578A Granted JPS54159177A (en) | 1978-06-07 | 1978-06-07 | Resin sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54159177A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
-
1978
- 1978-06-07 JP JP6778578A patent/JPS54159177A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
JPS6227750B2 (ja) * | 1981-05-18 | 1987-06-16 | Matsushita Electronics Corp |
Also Published As
Publication number | Publication date |
---|---|
JPS624861B2 (ja) | 1987-02-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BE839972A (fr) | Procede pour la fabrication d'un dispositif semiconducteur | |
JPS548462A (en) | Manufacture for semiconductor | |
JPS54159177A (en) | Resin sealed semiconductor device | |
FR2280201A1 (fr) | Procede pour la fabrication d'un dispositif a semi-conducteurs | |
JPS5222849A (en) | Electronic lexicography | |
JPS5275180A (en) | Package for integrated circuits | |
JPS53133371A (en) | Lead frame of plastic package for integrated circuit | |
JPS5244963A (en) | Method and apparaus for removing accumulated material on hopper surfac e | |
JPS5338277A (en) | Production of semiconductor device | |
JPS5352922A (en) | Mold transformer | |
JPS51132264A (en) | A moulding material of thermosetting resin | |
JPS5433022A (en) | Vessel for photographic processing liquid | |
JPS53142176A (en) | Manufacture of semiconductor device | |
JPS5418280A (en) | Resin sealed semiconductor device | |
JPS53120272A (en) | Manufacture of semiconductor device | |
JPS5213115A (en) | Fluid surface stabilizer | |
JPS5345975A (en) | Mask for exposure | |
JPS5233260A (en) | Air blast apparatus | |
JPS53135844A (en) | Photochemical etching procee | |
JPS532079A (en) | Frame structure for semiconductor device and its manufacture | |
JPS5243427A (en) | Method for photoengraving light sensitive resin | |
JPS522865A (en) | Process for growing aerosol particles by condensation of water vapors | |
JPS54118173A (en) | Etching method for semiconductor element | |
JPS5367358A (en) | Semiconductor device | |
JPS5246584A (en) | Material automatic supply device |